Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure

Abstract

According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Description

RELATED APPLICATIONS[0001]This application is a divisional of application Ser. No. 11 / 381,297, filed May 2, 2006, entitled “Method and Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure,” now U.S. Pat. No. ______.TECHNICAL FIELD OF THE INVENTION[0002]This invention relates in general to cooling techniques and, more particularly, to a method and apparatus for cooling electronics with a coolant at a subambient pressure.BACKGROUND OF THE INVENTION[0003]Some types of electronic circuits use relatively little power, and produce little heat. Circuits of this type can usually be cooled satisfactorily through a passive approach, such as convection cooling. In contrast, there are other circuits which consume large amounts of power, and produce large amounts of heat. One example is the circuitry used in a phased array antenna system. Others include other types of electronics, such as densely packed electronics used for current and future computational circuits, which ca...

AI Technical Summary

Benefits of technology

[0006]Some embodiments of the invention may provide numerous technical advantages. Other embodiments may realize some, none, or all of these advantages. For example, according to one embodiment, large amounts of heat may be removed from a heat-generating structure, allowing, for example, more densely-packed electronics to be utilized.

Problems solved by technology

In contrast, there are other circuits which consume large amounts of power, and produce large amounts of heat.

However, suitable refrigeration units are large, heavy, and consume many kilowatts of power in order to provide adequate cooling.

Although refrigeration units of this type have been generally adequate for their intended purposes, they have not been satisfactory in all respects.

An equally important factor is the inability of existing methods to remove high flux heat loads from electronic components and modules.

Existing approaches, which use a coolant flowing inside a coldplate or thermal plane to which electrical components and modules are mounted, have inadequate heat transfer performance to meet future needs.

In addition, approaches using two-phase, sprayed fluorinerts are not satisfactory in all respects.

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