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Group iii nitride semiconductor device and light-emitting device using the same

a technology of nitride and semiconductors, applied in the direction of semiconductor devices, basic electric elements, electrical appliances, etc., can solve the problems of large amount of crystal defects, high dissociation pressure, and failure to retain single crystals, etc., to achieve high reverse withstand voltage and improve crystallinity

Inactive Publication Date: 2010-10-21
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0009]An object of the present invention is to provide a Group III nitride semiconductor device exhibiting improved crystallinity and good performance. Another object of the present invention is to provide a Group III nitride semiconductor light-emitting device exhibiting high reverse withstand voltage; i.e., a high threshold voltage at which a reverse current begins to flow.
[0011]According to the present invention, there are obtained a Group III nitride semiconductor device of improved crystallinity, and a Group III nitride semiconductor light-emitting device exhibiting high reverse withstand voltage; i.e., a high threshold voltage at which reverse current begins to flow.

Problems solved by technology

Growing only a nitride single crystal itself has been considered difficult, for the following reasons.
Nitrogen, which is a constituent of the single crystal, has high dissociation pressure and therefore fails to be retained in the single crystal in, for example, the pulling method.
However, even when a nitride semiconductor single crystal is grown directly on such a single-crystal substrate, large amounts of crystal defects, which are attributed to crystal lattice mismatch between the crystalline substrate and the single crystal, are generated in the resultant nitride semiconductor single crystal film; i.e., the epitaxial film fails to exhibit good crystallinity.

Method used

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  • Group iii nitride semiconductor device and light-emitting device using the same
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[0045]FIG. 5 is a schematic representation showing the Group III nitride semiconductor light-emitting device of the present invention produced in the present Example. Reference numeral 1 denotes a substrate composed of sapphire. Semiconductor layers were grown along the crystal plane orientation of the substrate. A first layer 2 composed of Al0.08Ga0.92N doped with Si (5×1018 atoms / cm3) was formed on the substrate. A second layer 3 composed of an undoped GaN single crystal layer, and an n-type GaN single crystal layer 4 doped with Si (1×1018 atoms / cm3) were successively formed on the first layer 2. A light-emitting layer 6 was formed, via a Ga0.98In0.02N layer 5, on the Si-doped GaN single crystal layer 4. The Ga0.98In0.02N layer 5 is provided between the Si-doped GaN layer 4 and the light-emitting layer 6 for preventing propagation of crystal defects from the Si-doped GaN layer 4.

[0046]The light-emitting layer 6 has a structure including a plurality of stacked layer units, each inc...

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Abstract

A Group III nitride semiconductor device and method for producing the same. The device includes a substrate, and a plurality of Group III nitride semiconductor layers provided on the substrate. A first layer which is in contact with the substrate is composed of AlxGa1-x N (0≦x≦1), and the difference in height between a protrusion and a depression which are present at the interface between the first layer and a second layer provided thereon is 10 nm or more and is equal to, or less than, 99% the thickness of the first layer. The method includes a first step of depositing on a substrate, a layer containing fine Group III metal particles containing silicon; a second step of nitridizing the fine particles in an atmosphere containing a nitrogen source; and a third step of growing a Group III nitride semiconductor single crystal on the thus-nitridized fine particles.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application is a Divisional of U.S. application Ser. No. 10 / 583,336 filed on Jun. 19, 2006, which further claims priority from U.S. Provisional Application No. 60 / 532,924 filed on Dec. 30, 2003, the entire disclosures of which are incorporated herein by reference.TECHNICAL FIELD[0002]The present invention relates to a Group III nitride semiconductor device, exhibiting good crystallinity, which is employed in, for example, light-emitting diodes, laser diodes, and electronic devices.BACKGROUND ART[0003]Group III nitride semiconductors have a direct transition band structure and exhibit bandgap energies corresponding to the energy of visible to ultraviolet light. By virtue of these characteristics, Group III nitride semiconductors are employed at present for producing light-emitting devices, including blue LEDs, blue-green LEDs, ultraviolet LEDs, and white LEDs (which contain a fluorescent substance in combination with such a nitride sem...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/20H01L21/205H01L33/00H01L33/12H01L33/32
CPCH01L21/0237H01L21/0242H01L21/02433H01L21/02458H01L21/02494H01L21/02513H01L33/325H01L21/02576H01L21/02579H01L21/02614H01L21/0262H01L33/007H01L33/12H01L21/0254
Inventor SAKURAI, TETSUO
Owner RESONAC HOLDINGS CORPORATION
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