Method of manufacturing a heat transport device, heat transport device, electronic apparatus, and caulking pin

Inactive Publication Date: 2010-10-07
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]In this embodiment, the injection path is sealed by caulking under the reduced pressure, that is, the injection path is temporarily sealed before the welding process, with the result that the airtightness of the action area in the casing can be secured before the welding process. Because the contact process and the welding process of the peripheral area of the injection opening are performed in the state where the action area of the airtightness is secured, it is possible to improve the airtightness of the action area in the casing of the product.
[0046]As described above, according to the embodiments of the present invention, in the temporary sealing process in the manufacturing process, the airtightness in the casing of the heat transport device can be improved. Further, the airtightness in the casing of the heat transport device as a completed product can also be improved.

Problems solved by technology

In the heat pipe disclosed in Patent Document 1, the thermoplastic metal is used as a sealing member for the hole, which has a problem of low reliability of airtightness in the heat pipe.
In this case, the thermoplastic metal as the sealing member may be molten or softened, which may cause a clearance in the hole.
Therefore, there is a problem in that the airtightness in the heat pipe is difficult to be maintained.

Method used

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  • Method of manufacturing a heat transport device, heat transport device, electronic apparatus, and caulking pin
  • Method of manufacturing a heat transport device, heat transport device, electronic apparatus, and caulking pin
  • Method of manufacturing a heat transport device, heat transport device, electronic apparatus, and caulking pin

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first embodiment

Structure of Heat Transport Device

[0071]FIG. 1 is a perspective view showing a heat transport device 100 according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the heat transport device 100 taken along a line perpendicular to a longitudinal direction of the heat transport device 100 shown in FIG. 1 (taken along the line A-A of FIG. 1). FIG. 3 is a perspective view of the heat transport device 100 in a manufacturing process.

[0072]The heat transport device 100 includes a flat plate 1, a capillary member 3, a vapor flow path (not shown), and a dish-like container plate 2 having a concave portion 2a in which the capillary member 3 and the vapor flow path are contained. The flat plate 1, the capillary member 3, and the container plate 2 are formed into a rectangular shape, for example. The flat plate 1 and the container plate 2 constitute a casing 12 of the heat transport device 100.

[0073]In the casing 12, a working fluid (not shown) that trans...

second embodiment

[0105]FIG. 10 is an enlarged plan view showing an area in the vicinity of an injection opening 31a of a heat transport device 200 according to a second embodiment. In the following, descriptions on the same portions and functions as those of the heat transport device 100 according to the first embodiment shown in FIG. 1 and the like will be simplified or omitted, and descriptions on different points will be mainly given.

[0106]An injection path 33 of a casing 32 of the heat transport device 200 has an L-letter shape and is connected to an edge portion 8a of the action area 8, thereby allowing the injection path 33 and the action area 8 to communicate with each other. Like the heat transport device 100 according to the first embodiment, the heat transport device 200 includes a flat plate 31 having the injection opening 31a, a container plate having the L-letter shaped injection path 33, and the capillary member 3 (see, FIG. 3).

[0107]FIG. 11 is a flowchart showing a manufacturing metho...

third embodiment

[0113]FIG. 12 is an enlarged plan view showing an area in the vicinity of an injection opening of a heat transport device according to a third embodiment of the present invention. In a case where a linear, elongated injection path 19 shown in the figure is provided to a casing 17, the casing is circularly crushed by the manufacturing method described in the second embodiment, a temporary sealing groove 18b is formed on a flat plate 18. As a result, the same effect as in the second embodiment can be obtained.

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Abstract

A method of manufacturing a heat transport device includes injecting a working fluid that transports heat by a phase change into a casing through an injection opening of the casing under reduced pressure, sealing an injection path by caulking under the reduced pressure, the injection path being provided in the casing into which the working fluid is injected and causing the injection opening and an action area in which the phase change of the working fluid occurs to communicate with each other, contacting a peripheral area of the injection opening of the casing with an inner surface of the injection path by caulking the peripheral area, the peripheral area including the injection opening, and sealing the injection opening by welding a part of the casing contacted.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat transport device that transports heat by a phase change of a working fluid, and to a manufacturing method of the same, an electronic apparatus equipped with a heat transport device, and a caulking pin.[0003]2. Description of the Related Art[0004]In the past, a flat-plate heat pipe has been widely used as a device that cools a heat source such as a CPU (central processing unit). A flat-plate heat pipe cools a CPU and the like by using a phase change of a working fluid, and therefore contains a working fluid therein.[0005]For example, Japanese Patent Application Laid-open No. 2007-315745 (hereinafter, referred to as Patent Document 1) discloses a flat-plate heat pipe, on an outer surface of which a refrigerant injection hole and an air outlet hole are formed. In the flat-plate heat pipe, a refrigerant such as water is injected through the refrigerant injection hole, and then a therm...

Claims

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Application Information

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IPC IPC(8): B21D53/02
CPCF28D15/0233F28D15/0283H01L23/427Y10T29/4935H01L2924/0002H01L2924/00
Inventor YAJIMA, TAKASHIGOTO, KAZUOYAMASHITA, KEITAROSAKAMOTO, KAZUYA
Owner SONY CORP
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