Core-shell structure metal nanoparticles and its manufacturing method thereof

Abstract

Metal nanoparticles, containing a copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a U.S. divisional application filed under 35 USC 1.53(b) claiming priority benefit of U.S. Ser. No. 11 / 709,242 filed in the United States on Feb. 22, 2007, which claims earlier priority benefit to Korean Patent Application No. 10-2006-0018250 filed with the Korean Intellectual Property Office on Feb. 24, 2006, the disclosures of which are incorporated herein by reference.BACKGROUND[0002]1. Field[0003]The present invention relates to a method of producing metal nanoparticles and the metal nanoparticles thus produced, and in particular, to metal nanoparticles of core-shell structure and its manufacturing method.[0004]2. Description of the Related Art[0005]General ways to produce metal nanoparticles are the vapor-phase method, the solution (colloid) method and a method using supercritical fluids. Among these methods, the vapor-phase method using plasma or gas evaporation is generally capable of producing metal nanoparticl...

AI Technical Summary

Benefits of technology

[0009]The present invention provides metal nanoparticles, containing a copper as a core and a thin layer of a precious metal enclosing the core to prevent oxidization of copper and provide economical efficiency because of increased copper content. Since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that the metal migration may occur. The present invention also provides conductive ink containing these metal nanoparticles.

[0010]The invention provides a method of producing metal nanoparticles having an copper core-precious metal shell structure that have not been obtained so far, by decreasing reduction potential difference between copper and precious metals, using a reducing agent.

[0011]Further, the present invention provides a method of manufacturing metal nanoparticles economically in a liquefied condition, which does not require complicated facilities, rigorous conditions, and harsh air condition.

[0013]Here, the metal having higher reduction potential than copper may include one or more metals selected from a group consisting of silver, palladium, platinum, gold and alloys thereof. A diameter may be 50-100 nm and a thickness of the metal thin layer may be 1-50 nm. Such a metal thin layer prevents copper in the metal nanoparticles from oxidation.

Problems solved by technology

Among these methods, the vapor-phase method using plasma or gas evaporation is generally capable of producing metal nanoparticles with the size of several tens of nm, but has limitation in synthesizing small-sized metal nanoparticles of 30 nm or less.

Also, the vapor-phase method has shortcomings in terms of solvent selection and costs, particularly, in that it requires highly expensive equipments.

However, the production of metal nanoparticles by this existing method provides very low yield rate, as it is limited by the concentration of the metal compound solution.

This represents a limitation to efficient mass production.

Moreover, the phase transfer method necessarily requires a phase transfer, which is a cause of increased production costs.

However, since these metals are expensive and cause increase of production cost of electronic devices, the use of copper which has desired conductivity and economical efficiency is needed.

However, if copper is used to produce nanoparticles, it is oxidized easily and an oxidized layer is formed on the surface so that the conductivity decreases rapidly.

Therefore, there is a risk that may cause potential inferiority even after formation of wiring, actually the inferiority caused by the migration of silver incurs the inferiority of entire goods.

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