Method for producing silver nanoparticles and conductive ink

Abstract

A method of producing metal nanoparticles in a high yield rate and uniform shape and size, which is thus suitable for mass production. In addition, metal nanoparticles are provided that have superior dispersion stability when re-dispersed in various organic solvents, which thus suitable for use as a conductive ink having high conductivity. The method of producing nanoparticles includes mixing a metal precursor with a copper compound to a hydrocarbon based solvent, mixing an amine-based compound to the mixed solution of the metal precursor with copper compound and hydrocarbon based solvent, and mixing a compound including one or more atoms having at least one lone pair, selected from a group consisting of nitrogen, oxygen, sulfur and phosphorous to the mixed solution of the amine-based compound, metal precursor with a copper compound and hydrocarbon based solvent.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2005-0072478 filed on Aug. 8, 2005, with the Korea Intellectual Property Office, the contents of which are incorporated here by reference in their entirety.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to a method of producing metal nanoparticles, in particular, to a method of producing metal nanoparticles with the solution method.[0004]2. Description of the Related Art[0005]Major ways to produce metal nanoparticles are the vapor-phase method and the solution (colloid) method. Since the vapor-phase method which uses plasma or gas evaporation requires highly expensive equipments, the solution method which is easy for the production is generally used.[0006]A method of producing metal nanoparticles by the solution method up to now is to dissociate a metal compound in a hydrophilic solvent and then apply a reducing agent or a surfactant to produce ...

AI Technical Summary

Benefits of technology

[0008]The present invention provides a method of producing metal nanoparticles, not requiring high reaction temperature by using a copper compound as a reducing agent and having a high yield rate and uniform size achieved by a simple process. In addition, the present invention provides metal nanoparticles of several or several tens of nanometer size and a high conductive ink including the metal nanoparticles thus obtained.

Problems solved by technology

However, the production of metal nanoparticles by this existing method provides a very low yield rate, as it is limited by the concentration of the metal compound solution.

Thus, there is a limit also on the yield of metal nanoparticles, and to obtain metal nanoparticles of uniform size in quantities of several grams, 1000 liters or more of functional group are needed.

This represents a limitation to efficient mass production.

Moreover, the phase transfer method necessarily requires a phase transfer, which is a cause of increased production costs.

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