Thin Semiconductor Device And Operation Method Of Thin Semiconductor Device

Abstract

The present invention provides a thin semiconductor device in which its security such as prevention of counterfeit or information leakage is to be enhanced. One feature of the present invention is a thin semiconductor device in which a plurality of thin film integrated circuits are mounted and in which at least one integrated circuit is different from the other integrated circuits in any one of a specification, layout, frequency for transmission or reception, a memory, a communication means, a communication rule and the like. According to the present invention, a thin semiconductor device tag having the plurality of thin film integrated circuits communicates with a reader / writer and at least one of the thin film integrated circuits receives a signal to write information in a memory, and the information written in the memory determines which of the thin film integrated circuits communicates.

Description

TECHNICAL FIELD [0001] The present invention relates to a thin semiconductor device in which a thin film integrated circuit is mounted and an operation method of the thin semiconductor device. BACKGROUND ART [0002] As for a conventional non-contact IC card, there is proposed a structure in which capacity adjustment of a capacitor for setting the resonance frequency of a resonant circuit in an antenna mechanism is not required, mechanical damages to elements constituting a card are minimalized, and mass-productivity is increased. The structure has a plane coil which is connected to a non-contact IC chip and plural other plane coils which are arranged in the periphery thereof (References 1: Japanese Patent Laid-Open No. 2001-109861 and Reference 2: Japanese Patent Laid-Open No. 2001-109862). According to References 1 and 2, each of resonance frequencies is a frequency of high frequency electromagnetic field from a reader / writer device, a frequency shifted up / down to some extent, or th...

AI Technical Summary

Benefits of technology

[0004] As for such conventional IC cards according to References 1 to 3, preventing counterfeit of such cards has been not considered. No measures for preventing information leakage have been made.

[0005] It is an object of the present invention to provide a thin semiconductor device whose security for prevention of counterfeit or information leakage is to be enhanced.

[0015] According to the present invention, the security of a thin semiconductor device can be improved. According to the present invention, a new operation method of a thin semiconductor device can be provided. In the operation method of the present invention, the memory can be a nonvolatile memory. Using the nonvolatile memory that can write to only once can prevent falsification. The nonvolatile memory can further enhance the security of a thin semiconductor device.

[0016] In the operation method of the present invention, the memory can be a rewritable memory. Thus, the thin film integrated circuit can be reused to contribute to lower cost of thin semiconductor devices.

[0017] Since a thin film integrated circuit of the present invention is formed over an insulating substrate, it has fewer limitations on the shape of a mother substrate as compared with an IC chip formed by using a circular silicon wafer. Therefore, mass-productivity of thin film integrated circuits is enhanced and thus thin film integrated circuits can be mass-produced. As the result thereof, cost reduction of thin film integrated circuits can be expected. A thin film integrated circuit formed at extremely low unit cost can generate big profits by the reduction of unit costs.

Problems solved by technology

No measures for preventing information leakage have been made.

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