Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same

Abstract

Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

Description

INCORPORATION BY REFERENCE [0001] The present application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 2004-67487 filed on Aug. 26, 2004. The content of the application is incorporated herein by reference in its entirety. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates, in general, to a printed circuit board (PCB) including embedded capacitors and a method of fabricating the same and, more particularly, to a PCB including embedded capacitors, in which a dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor, and a method of fabricating the same. [0004] 2. Description of the Prior Art [0005] Typically, discrete chip resistors or discrete chip capacitors have been frequently mounted on most printed circuit boards (PCB), but, recently, PCBs are developi...

AI Technical Summary

Benefits of technology

[0046] Another object of the present invention is to provide a PCB including embedded capacitors each having a high dielectric constant and a method of fabricating the same, in which only a desired part is made of a ceramic material to form a dielectric thin film (or thick film), thereby creating the embedded capacitors. Accordingly, a loss of costly raw materials is reduced and unnecessary processes, such as a process of etching a dielectric, may be omitted, consequently, material costs are reduced and ease of production is assured.

Problems solved by technology

However, a market for PCBs including embedded capacitors is not yet activated.

Accordingly, standardization of the above methods has not been achieved yet, but commercialization of the methods is under development.

In conventional technologies, a long connection length between devices at a high frequency brings about occurrence of an electric parasitic load, thereby reducing the electric performances of goods.

Additionally, the number of connections increases due to a solder, causing poor reliability of goods.

Furthermore, in the third conventional technology, capacitance is low due to a low dielectric constant of an embedded capacitor layer.

Accordingly, there are many limits to the realization of the conventional embedded capacitor.

However, these procedures result in increased production costs because the formation of upper and lower electrodes, and exposure and etching processes for patterning the insulating layer are additionally carried out.

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