Envelope for mailing of cards containing an embedded chip
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[0025] This invention relates to mailing envelopes and in particular, to a mailing envelope used for mailing of a rigid module that is embedded in a plastic or non-plastic substrate commonly referred to as a card.
[0026] The envelope has a unique glue design of a false bottom using paper of a specified quality and weight. The envelope design and paper quality selected provide it with sufficient strength for use with high speed insertion equipment. The envelope is also light enough that with card and insertions, the resulting letter weighs one ounce or less.
[0027]FIG. 1 shows the back side of an envelope. In manufacturing the envelope, side flaps 4, 4 are provided which in the preferred embodiment, have a minimum one inch width.
[0028] Glue lines 6, 6 are provided on each side and the gluing on the side flaps extends to the side edge immediately below the top edge to immediately below the bottom edge. In this manner, no glue is exposed.
[0029] A false bottom 8 is provided on the env...
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