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Latent curing agent and composition

a technology of curing agent and composition, applied in the field of latent curing agent, can solve the problems of reducing operating efficiency, affecting the curability of the curing agent, and inability to prepare a large amount of mixture in advance, and achieve the effect of high curability

Inactive Publication Date: 2007-03-08
ASAHI KASEI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0040] The curing agent of the present invention is effective in attaining not only high curability but also storage stability.

Problems solved by technology

Therefore, the storage and handling of the epoxy resin composition are complicated.
In addition, since application-available time is limited, a large amount of mixture cannot be prepared in advance.
Therefore, the mixing operation must be performed frequently, inevitably decreasing operating efficiency.
Of the latent curing agents, however, when agents are excellent in storage stability but poor in curability, they require high temperature and long time for curing.
On the other hand, when agents are excellent in curability but poor in storage stability, they must be stored at a temperature as low as −20° C. To describe more specifically, the storage stability of a composition containing dicyandiamide is not less than 6 months when stored at room temperature; however, it requires a curing temperature of not less than 170° C. If a curing accelerator is used to reduce the curing temperature, curing can be performed at 130° C.; however, the storage stability at room temperature becomes insufficient, with the result that it is inevitably stored at low temperature.
When a conventional latent curing agent is employed as a curing agent in such a composition, the storage stability extremely decreases.
Unfortunately, it has been difficult to satisfy the desire by a conventional technology.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

production example 1

(Production of Curing Agent (A) for Epoxy Resin)

[0173] Two equivalents of a bisphenol A-type epoxy resin (epoxy equivalent: 185 g / equivalent, total chlorine amount: 1200 ppm; hereinafter referred to as an “epoxy resin c-1”), 0.66 mol of o-dimethylaminomethyl phenol, and 0.33 mole of dimethylamine were reacted in a solvent mixture containing methanol and toluene in the ratio of 1:1 (resin content: 50%) at 80° C. for 8 hours, and then the solvent was removed at 180° C. under reduced pressure to obtain a solid-state compound. The solid-state compound was pulverized to obtain particles of a curing agent a-1 for an epoxy resin having an average diameter of 2.5 μm.

production example 2

(Manufacturing of Curing Agent (A) for Epoxy Resin)

[0174] Two Equivalents of a bisphenol A-type epoxy resin (epoxy equivalent: 185 g / equivalent, total chlorine amount: 20 ppm; hereinafter referred to as an “epoxy resin c-2”) and 1.5 mol of 2-methyl imidazole were reacted in a solvent mixture containing methanol and toluene in the ratio of 1:1 (resin content: 50%) at 80° C. for 6 hours, and then the solvent was removed at 180° C. under reduced pressure to obtain a solid-state compound. The solid-state compound was pulverized to obtain particles of a curing agent a-2 for an epoxy resin having an average diameter of 3 μm.

example 1

[0175] To 100 parts by mass of xylene, 2 parts of Jeffamine D-230 (polyoxyalkylenediamine manufactured by Sun Techno Chemical Co., Ltd.) was dissolved. To the mixture, 75 parts by mass of the curing agent a-1 for an epoxy resin was added and dispersed. The temperature of the resultant solution was adjusted to 20° C. To this mixture, a solution mixture of 4 parts by mass of 1,8-diisocyanate-4-isocyanate methyl octane (hereinafter referred to as “OTI”) and 100 parts by mass of xylene was added dropwise over 2 hours. After completion of dropwise addition, a reaction was performed at 40° C. for 4 hours, continuously. After it was confirmed that OTI disappeared from the xylene phase, the reaction was terminated. In this manner, a latent curing agent for an epoxy resin was obtained. Furthermore, xylene was removed and 300 parts by mass of bisphenol A-type epoxy resin (epoxy equivalent: 189 g / equivalent, total chlorine amount: 1200 ppm; hereinafter referred to as an “epoxy resin c-3”) was ...

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Abstract

A latent curing agent for an epoxy resin containing a curing agent (A) for an epoxy resin and a resin coating said curing agent (A) for an epoxy resin, wherein the resin coating said curing agent (A) for an epoxy resin comprises a structure in which two of the structure (structure (1)) are bonded via a urea bonding, the structure (1) being obtained by bonding three sulfur atoms at a branching point via a linear or cyclic aliphatic hydrocarbon group optionally containing an ester structure, wherein at least one of nitrogen atoms of each structure (1) is incorporated into said urea bonding; and a one component epoxy resin composition using the latent curing agent. The above one component epoxy resin composition which can exhibit high curability and storage stability in combination. The above latent curing agent can suitably used for producing the one component epoxy resin composition, which can provide an anisotropic electroconductive material, an electroconductive adhesive material, an insulating adhesive material, a sealing material or the like which exhibits high storage stability, and also exhibits high adhesion reliability and adhesive strength and high sealability.

Description

TECHNICAL FIELD [0001] The present invention relates to a novel latent curing agent for an epoxy resin and a one-component epoxy resin composition using the same. More particularly, the present invention relates to a latent curing agent for an epoxy resin composition having not only high curability but also excellent storage stability and a one-component epoxy resin composition using the same. BACKGROUND ART [0002] Epoxy resins have been used in a wide variety of applications such as paints, electric / electronic insulating materials, and adhesive agents since their cured products have excellent performance in properties such as mechanical characteristics, electric characteristics, thermal characteristics, chemical resistance, and adhesion. General epoxy resin compositions presently in use belong to a so-called two-component composition, which is used by mixing two liquids, an epoxy resin and a curing agent, when used. [0003] The two-component epoxy resin composition can be cured at r...

Claims

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Application Information

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IPC IPC(8): C08L63/00B32B5/16B32B27/38C08G59/18C08G59/40H01B1/22H05K3/32
CPCC08G59/188C08G59/4021Y10T428/2991H05K3/321H05K3/323H01B1/22C08G59/40C08G73/06C08L63/00
Inventor USUI, TAKETOSHITAKADA, YOSHIHIKO
Owner ASAHI KASEI CHEM CORP
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