Easily assembled cooler

Abstract

A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1a, 1b, each of which is formed into a predetermined shape by press molding, and fins 5 for accelerating heat exchange are arranged in the tube 1. As an inner wall conventionally exists when the tube 1 is manufactured by extrusion, can be removed, it is no longer necessary to remove the inner wall by machining, therefore, the fabrication cost can be reduced.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a cooler for cooling electronic parts and can be preferably used, particularly, as a cooler for cooling electronic parts of a double-sided cooling type in an inverter for a hybrid electric vehicle. More particularly, the present invention relates to a cooler of a built-up type for cooling an electronic part from both sides thereof. [0003] 2. Description of the Related Art [0004] Conventionally, a known semiconductor module (an electronic part) is attached to a cooler of a water-cooling type for cooling. A semiconductor device of a double-sided cooling type is proposed in Patent document 1. The device described in Patent document 1 has a configuration in which tubes having a cooling water passage and semiconductor modules of a double-sided cooling type are piled alternately and a pressing force is applied in the direction of built-up of the tubes to hold the semiconductor modules betw...

AI Technical Summary

Benefits of technology

[0019] The above-mentioned problems being taken into account, an object of the present invention is to provide a cooler capable of reducing the forming process cost and further, the manufacturing cost. Another object of the present invention is to make it possible to ensure a sufficient contact area between an electronic part and a tube without increasing the number of parts.

Problems solved by technology

Because of this, there is the possibility that the manufacture of the cooler of a built-up type 2009 requires a large number of parts and, therefore, the manufacturing cost thereof is high.

Because of this, a problem arises in that the manufacturing cost is high and, at the same time, the productivity is difficult to improve.

Therefore, this process raises the cost.

Moreover, the extruded tube 1 requires side caps and this also raises the cost.

Moreover, the first conventional device and the second conventional device require the elastic cylinder sections or the flange-shaped cylinder sections, the number of which corresponding to the number of piled layers of the tubes and, therefore, a problem arises in that the number of parts of a product is increased.

In the third conventional device, as the tube is deformed in an arc shape, it is not possible for the tube to completely come into close contact with the surface of the semiconductor module and a problem arises in that the contact area between two decreases.

Moreover, the third conventional device brings about a problem in that, when the tube deforms, stress tend to concentrate on the joined parts between the tubes and the header tanks.

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