Temperature measuring device and heat tube measuring system

A technology of measurement and heat pipe, applied in the field of heat transfer, can solve the problems of indirect and reliable heat pipe surface contact, actual temperature error of heat pipe surface, high cost, etc., to reduce heat pipe measurement cost, reduce interface thermal resistance, and improve accuracy Effect

Inactive Publication Date: 2010-09-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat pipe temperature measurement method needs to be dipped with heat-conducting adhesive every time the thermocouple is fixed, which is very expensive, and generally the heat pipe is round, and it is difficult to apply force to the heat-resistant tape by hand, which will easily cause the thermocouple to be damaged. The contact with the surface of the heat pipe is not direct and reliable, resulting in an error between the measurement result and the actual temperature of the heat pipe surface
Similarly, the measurement results of the heat pipe measurement system using the temperature measurement method are unreliable, and the actual performance of the heat pipe cannot be accurately measured.

Method used

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  • Temperature measuring device and heat tube measuring system
  • Temperature measuring device and heat tube measuring system
  • Temperature measuring device and heat tube measuring system

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Embodiment Construction

[0016] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0017] Please refer to Figure 1 to Figure 4 , the temperature measuring device 1 provided by the present invention includes: a clamping part 20 and at least one measuring assembly 10, and the clamping part 20 is provided with an accommodating cavity 21 and at least one respectively connected with the accommodating cavity 21 The insertion hole 22, the accommodating cavity 21 is used to clamp the heat pipe 2 to be measured, the insertion hole 22 is used to place the measurement assembly 10, each measurement assembly 10 includes: a bearing block 11, a pressing Block 12, a spring 13 and a thermocouple 14, the spring 13 is supported between the bearing block 11 and the pressure block 12, and the thermocouple 14 is attached to the surface 15 of the bearing block 11 away from the spring 13 , used to measure the temperature of the heat pipe 2. The spring 13 can be...

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Abstract

The temperature-measuring device includes gripping part, at least a measurement module, accommodation cavity on the gripping part, and at least one insertion hole connected to the accommodation cavity. The accommodation cavity is in use for gripping heat pipe to be measured. The insertion hole is in use for accommodating the measuring module. Being in use for fixing measuring module to be measured, locative structure includes a load bearing block, a pressing block, an elastic cell, and a thermocouple. The elastic cell supports between the load bearing block and the pressing block. Being attached to surface, which is apart from the elastic cell, of load bearing block, the thermocouple is in use for measuring temperature of heat pipe. Through elastic force generated by contraction in lengthof the elastic cell, the thermocouple contacts heat pipe tightly so as to raise accuracy for measuring temperature of heat pipe.

Description

【Technical field】 [0001] The invention relates to the field of heat transfer, in particular to a temperature measuring device and a heat pipe measuring system. 【Background technique】 [0002] In recent years, the rapid development of electronic technology, the high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits have caused a sharp increase in the heat generation of electronic devices per unit volume. Heat pipe technology is suitable for solving current electronic problems due to its high efficiency, compactness, flexibility and reliability. The heat dissipation problem derived from the performance improvement of the device. [0003] A heat pipe is a hollow sealed tube, usually including a shell, a capillary wick (capillary structure) close to the inner wall of the shell, and a working fluid sealed in the shell. One end is the evaporation end (heating end), and the other end is The condensing end (cooling end), accor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/02
Inventor 吴承勋
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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