Device for cutting substrate
A technology for a reference positioning device and a substrate, which is applied to glass cutting devices, stone processing equipment, instruments, etc., can solve problems such as difficulty in controlling the precise position of the scriber 31 and increasing control errors of the conveyor belt 32.
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[0031] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. The invention may, however, encompass different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these specific embodiments are provided as examples to teach the invention. The same reference numerals denote the same elements.
[0032] 5 is a view illustrating the structure of an apparatus for cutting a substrate according to an embodiment of the present invention, and FIG. 6 is a view illustrating the structure of another apparatus for cutting a substrate according to another embodiment of the present invention.
[0033] As shown in FIG. 5, the apparatus for cutting a substrate is used to cut a brittle substrate 42, such as a glass substrate. The scribing process uses a first scriber 43a and a second scriber 43b using cutting wheels.
[0034] The co...
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