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Conveying chamber, substrate processing device, and substrate disorder detection method

A technology of a conveying device and a detection method, which is applied in the field of a conveying room, and can solve problems such as difficult detection and inability to apply position deviation detection of glass substrates

Inactive Publication Date: 2007-03-14
TOKYO ELECTRON LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The misalignment detection device of Patent Document 1 is aimed at small circular semiconductor wafers, and cannot be applied to misalignment detection of large rectangular glass substrates for FPDs.
In addition, the positional displacement detection device of Patent Document 1 measures the wafer in a stationary state, so the positional deviation can be accurately measured, but on the other hand, it is difficult to detect chipping at the edge of the glass substrate for FPD, etc. Substrate abnormalities are detected

Method used

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  • Conveying chamber, substrate processing device, and substrate disorder detection method
  • Conveying chamber, substrate processing device, and substrate disorder detection method
  • Conveying chamber, substrate processing device, and substrate disorder detection method

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Embodiment Construction

[0042] Next, preferred embodiments of the present invention will be described with reference to the drawings. Here, as a substrate processing apparatus, in a transfer chamber used in a multi-chamber plasma processing apparatus for performing plasma processing on a glass substrate for FPD (hereinafter simply referred to as a “substrate”) S, the substrate is abnormally treated. An example of detection will be described. Here, the FPD includes, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an electroluminescence (Electro Luminescence, EL) display, a fluorescent display tube (Vacuum Fluorescent Display, VFD), a plasma display panel (PDP), etc. .

[0043] FIG. 1 is a perspective view schematically showing a plasma processing apparatus according to one embodiment of the substrate processing apparatus of the present invention, and FIG. 2 is a horizontal cross-sectional view schematically showing its interior.

[0044] In this vacuum processing a...

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Abstract

The invention provides a substrate processing apparatus in which such a fault as misregistration or chipping of a large FPD substrate in a conveyance chamber can be detected certainly, and to provide a method for detecting the fault of the substrate. When a substrate (S) is mounted on the slide pick (513) of a conveying device and carried into a process chamber from the interior of a conveyance chamber (20) through a gate opening (22d), the substrate (S) is irradiated with light beams at the parts in the vicinity of the opposite ends shown by dashed lines (A, B) by means of a pair of sensors (70, 70) arranged on the right and left, and misregistration or defect of the substrate S is detected by its reflectivity or transmissivity.

Description

technical field [0001] The present invention relates to a transfer chamber, a substrate processing apparatus, and a substrate abnormality detection method, for example, to a transfer chamber of a substrate processing apparatus for performing etching or other processing on a glass substrate for a flat panel display (FPD), a substrate processing apparatus having the transfer chamber, And detection methods for substrate abnormalities such as substrate misalignment and chipping. Background technique [0002] In the manufacturing process of flat panel displays (FPDs) represented by liquid crystal displays (LCDs), a plurality of vacuum processing devices that perform predetermined processes such as etching, ashing, and film formation on glass substrates under vacuum are used. So-called multi-chamber type vacuum processing system. [0003] Such a vacuum processing system has a transfer chamber provided with a transfer device for transferring substrates, and a plurality of processi...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/67H01L21/66B65G49/06G01D5/34
CPCG02F1/1309H01L21/683
Inventor 冈部星儿末木英人
Owner TOKYO ELECTRON LTD
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