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Method for preparing radial glass packaged thermosensitive resistor

A glass encapsulation, thermistor technology, applied in the manufacture of encapsulated/cased resistors, resistors, non-adjustable metal resistors, etc., can solve the problems of low production efficiency, large quality fluctuations, poor consistency, etc., to achieve production efficiency High, good quality and easy to operate effect

Inactive Publication Date: 2007-02-28
广州市番禺区大通电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the domestic production of radial glass-encapsulated thermistors is mostly manual operation, with low production efficiency, large quality fluctuations, poor consistency, and low pass rate. Mating assembly

Method used

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  • Method for preparing radial glass packaged thermosensitive resistor
  • Method for preparing radial glass packaged thermosensitive resistor
  • Method for preparing radial glass packaged thermosensitive resistor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings.

[0018] As shown in Figure 1, the straightened Dumet silk 1 and the silver layer 2 of Dumet silk are selected to be ф0.15-ф0.5mm, and automatic straightening, fixed-length and cutting equipment are used for Dumet silk. Straighten and determine the length, print silver paste on one end of the Dumet wire, and form a good conductive layer after sintering. First fix the Dumet wire on the fixture, leaving a certain length on the left. Use the mobile jig to move to the fixed jig, and clamp the Dumet, then release the fixed jig. The moving fixture returns, and a certain force is applied in the radial direction, and the fixed fixture is clamped at this time. Set the position of the cutter and cut the Dumet. The mobile clamp is released. Repeat to get Dumets of the same length.

[0019] Arrange the Dumet silk on the mold and clamp it with glue board. The exposed end of the...

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PUM

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Abstract

The invention relates to a production of thermal-sensitive resistance packed by radial glass. Wherein, it positions the glass tube with clamper; the chip is inside the glass frame; the clamper positions the copper-coated iron and nickel alloy wire; it uses clamper to sheath the copper-coated iron and nickel alloy wire into glass frame; makes the silver layer of chip parallel with copper-coated iron and nickel alloy wire, between two copper-coated iron and nickel alloy wires to be pushed; the silver layer of chip, the silver layer of copper-coated iron and nickel alloy wire and the glass frame contact each other, via high-temperature packed, to be radial glass packed product, the invention uses chemical device to correct copper-coated iron and nickel alloy wire, plate silver layer, sheath glass frame, and mount the glass frame, with simple operation, high efficiency, and high yield.

Description

technical field [0001] The invention relates to a method for manufacturing a radial glass-encapsulated thermistor, which belongs to the field of thermistors. Background technique [0002] Radial glass-encapsulated thermistors are mainly used in temperature control and temperature detection of household appliances, temperature monitoring and temperature compensation of office automation equipment, temperature control and inspection of industrial, medical, and food processing equipment, liquid level indication and flow measurement, mobile phones battery etc. At present, the domestic production of radial glass-encapsulated thermistors is mostly manual operation, with low production efficiency, large quality fluctuations, poor consistency, and low pass rate. Matching assembly. Contents of the invention [0003] The purpose of the present invention is to avoid the deficiencies in the prior art and provide a cooperating assembly process of Dumet wire, glass shell, and chip to ...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C17/28H01C17/02
Inventor 张竞峰
Owner 广州市番禺区大通电子有限公司
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