Flame-retardant polyamide composition and its use
A polyamide composition and flame retardancy technology, applied in the field of connectors with excellent heat resistance, can solve the problems of hindering continuous production, deteriorating color quality of resin compositions, unsatisfactory flame retardancy and color stability, and the like, Achieve the effect of reducing mold maintenance frequency, improving continuous productivity, and high industrial value
Active Publication Date: 2007-02-14
MITSUI CHEM INC
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Problems solved by technology
In addition, when bromine-based flame retardants and antimony compounds are used together, in terms of productivity, a large amount of gas is generated during molding, which becomes the main cause of mold deposits, so frequent operations such as mold disassembly and cleaning are required, which hinders continuous production. main reason for productivity
In addition, the deterioration of the color quality of the resin composition due to the heat in the reflow soldering process is also a problem.
[0006] From this background, as substances that can replace antimony compounds, a variety of metal compounds have been proposed, and a flame-retardant resin composition in which part or all of the antimony compounds have been replaced by zinc borate has been proposed. Color stability cannot be satisfied
Method used
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[0100] The above-mentioned components were mixed in the molar ratio shown in Table 1, and put into a biaxial extruder with a port set at a temperature of 320° C. to melt and knead to obtain a pellet-shaped composition. Next, properties of the obtained polyamide composition were evaluated, and the results are shown in Table 1.
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Abstract
Provided is a polyamide compound which is free from an environmental problem caused by an antimony compound and from a problem in a production process caused by the generation of a gas, which is a main cause of a mold deposit particularly in the case of the combination use with a flame-retardant containing bromine, and is excellent in flame-retardancy, toughness and melt fluidity, and also exhibits good heat resistance and good color stability in a reflow soldering step being required in the surface mounting, and thus is suitable for electric and electronic parts. A flame-retardant polyamide composition, characterized in that it comprises 10 to 80 mass % of a polyamide (A), 5 to 40 mass % of a flame retardant (B), 0.5 to 10 mass % of zinc borate and at least one other salt of zinc (C), 0 to 60 mass % of an inorganic reinforcing material (D) and 0 to 5 mass % of a drip preventing agent (E).
Description
technical field [0001] The present invention relates to a flame-retardant polyamide composition having excellent mechanical properties such as toughness, good melt fluidity, low hygroscopicity, excellent heat resistance and color stability in a reflow soldering process, and characterized by not using an antimony compound And electric and electronic parts formed from the composition. [0002] More specifically, the present invention relates to a flame-retardant polyamide composition suitable for forming electric and electronic components such as small-pitch connectors having a thin wall and a short distance between connecting terminals, and a polyamide compound formed from the composition having excellent heat resistance. Connector. Background technique [0003] Conventionally, as a raw material for forming electronic components, polyamide that can be melted by heating and formed into a predetermined shape has been used. Generally, nylon 6, nylon 66, etc. are widely used as...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08K3/24C08K3/32C08K3/38
CPCC08K3/38C08L77/06C08K3/32
Inventor 大川由人
Owner MITSUI CHEM INC
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