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Organic inorganic composite photosensitive resin composition

A photosensitive resin and inorganic composite technology, applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problems of inability to spin coat dielectric constant, insufficient planarization, low dielectric constant, etc., and achieve high dielectric constant Characteristics, excellent performance, and the effect of improving dielectric properties

Active Publication Date: 2011-08-31
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide an organic-inorganic composite material to improve the weak point of the conventional gate insulating film to produce an organic-inorganic insulating material with excellent coating properties and flatness and a high dielectric constant. The organic-inorganic composite material make up for the existing SiO 2 The disadvantages of inorganic materials for gate insulators are high cost, low dielectric constant, insufficient planarization, and cannot be spin-coated, and the organic materials currently used as organic insulators for passivation have low dielectric constants.

Method used

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  • Organic inorganic composite photosensitive resin composition
  • Organic inorganic composite photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] (Preparation of metal oxide dispersion)

[0078] Prepare Al separately 2 O 3 , Y 2 O 3 , La 2 O 3 , Ta 2 O 3 , TiO 2 , HfO 2 , ZrO 2 , (ZrO 2 ) 0.5 (SiO 2 ) 0.5 And (HfO 2 ) 0.5 (SiO 2 ) 0.5 Use a rotary ball mill to pulverize the powder, add propylene glycol monomethyl ether acetate to make the content of the metal oxide powder reach 5% to 50% by weight, add 500ppm to 20,000ppm of dispersant, and mix after wet mixing. Spray drying to prepare a metal oxide dispersion with a particle size of 50 nm to 200 nm.

Embodiment 2

[0080] (Preparation of acrylic copolymer)

[0081] 10 parts by weight of 2,2-azobis(2,4-dimethylvaleronitrile), 200 parts by weight of propylene glycol monomethyl ether acetate, 20 parts by weight of methacrylic acid, and 35 parts by weight of glycidyl methacrylate , 15 parts by weight of methyl methacrylate and 30 parts by weight of styrene were added to a flask with a cooling tube and a stirrer, and then slowly stirred after nitrogen replacement. The temperature of the reaction liquid was raised to 62°C, and a polymer solution containing an acrylic copolymer was prepared while maintaining the temperature for 5 hours. The acrylic copolymer prepared above was added dropwise to 5000 parts by weight of hexane for precipitation. After filtration and separation, 200 parts by weight of propionate was added to it and heated to 30°C to obtain a solid concentration of 45 parts by weight. Parts of a polymer solution with a weight average molecular weight of 11,000. The weight average mo...

Embodiment 3

[0083] (Preparation of organic-inorganic composite photosensitive resin composition)

[0084] 100 parts by weight of the acrylic copolymer-containing polymer solution prepared in Example 2 above, 15 parts by weight of Irgacure 819 as a photoinitiator, and 5 parts by weight of 2-ethylhexyl-4-dimethylamino as a photosensitizer Benzoic acid ester and 5 parts by weight of n-butylacridone, 40 parts by weight of dipentaerythritol hexaacrylate as a multifunctional monomer, 10 parts by weight of trimethylolpropane triacrylate, and 1 part by weight as a silicon compound 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 2 parts by weight of F171 as a silicon-based surfactant were mixed. Diethylene glycol dimethyl ether was added to the above mixture and dissolved so that the concentration of the solid content reached 35% by weight.

[0085] The Al prepared in Example 1 2 O 3 The metal oxide dispersion and the organic photosensitive resin prepared above were mixed in a weight ratio of 5:95 to...

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Abstract

To provide an organic / inorganic photosensitive resin composition; which is superior in adhesion, heat resistance, insulation properties, flatness, chemical resistance or the like, and suitable for image forming materials of a liquid crystal display element. The resin composition includes (A) metal oxides selected from among groups consisting of group 3, 4, 5, 13 metal oxides, within a periodic table or groups, consisting of similar two element metal oxides; and (B) (a) acrylic-based copolymers, (b) photoinitiators, (c) polyfunctional monomers having ethylenically unsaturated bonds, (d) silicon-based compounds containing epoxy or amine groups, and (e) solvents.

Description

Technical field [0001] The present invention relates to an organic-inorganic composite photosensitive resin composition, and more specifically, to an organic-inorganic composite photosensitive resin composition, which has dielectric constant, transmittance, adhesion, heat resistance, insulation, and flatness , Chemical resistance and other excellent properties, suitable for imaging materials for liquid crystal display elements, especially when the organic insulating film of liquid crystal display elements is formed, due to its excellent dielectric constant, flatness, sensitivity, residual film rate, and UV transmittance Therefore, it is not only suitable for use as an organic insulating film for gate insulating film, but also when used as a resist resin for overcoat, resist resin for black matrix, resist resin for spacers, or resist resin for color filters. Sensitivity and residual film rate. Background technique [0002] Generally speaking, the most commonly used organic insula...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G02F1/136
CPCG03F7/0007G03F7/0044G03F7/028G03F7/033G03F7/075
Inventor 尹赫敏金柄郁尹柱豹丘冀赫吕泰勳郑义澈金东明崔相角李浩真申洪大李东赫
Owner DONGJIN SEMICHEM CO LTD
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