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Electronic assembly wire and flat cable comprising same

A technology of electronic components and flat cables, which is applied in the field of wires and flat cables for electronic components, can solve the problems of preventing whiskers, insufficient, high cost, etc., and achieve the effect of preventing and suppressing whiskers

Active Publication Date: 2006-10-18
MISUZU CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, it is not possible to sufficiently prevent the generation of whiskers by only performing such conventional heat treatment.
Furthermore, gold plating and the like do not generate whiskers, but the cost is too high, and SnPb alloy plating is not preferable from the viewpoint of environmental protection because lead is used.
Therefore, in recent years, SnBi (bismuth) alloy plating is attracting people's attention (for example, referring to Patent Document 1), but it is still not enough to prevent whiskers from occurring.

Method used

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  • Electronic assembly wire and flat cable comprising same
  • Electronic assembly wire and flat cable comprising same

Examples

Experimental program
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Effect test

Embodiment 1

[0035] After pretreatment such as electrolytic degreasing and pickling, the copper wire (conductive substrate) with a diameter of 0.6 mm is subjected to Sn Bi alloy plating using plating chemicals produced by Ishihara Pharmaceutical Co., Ltd. (Japanese name: Ishihara Pharmaceutical Co., Ltd.) to form a Sn alloy plating layer (bottom plating).

[0036] Next, Zn electroplating is performed to form an upper layer plating layer, and a lead wire having a double-layer structure plating layer is formed. Moreover, the stretching calender produced by SAIKAWA Corporation (Japanese name: サイカワ) performs stretching, calendering, and electrification annealing to make flat cables.

Embodiment 2

[0038] After carrying out electrolytic degreasing, pickling and other pretreatments to the copper wire (conductive substrate) with a diameter of 0.6 mm, Sn Zn alloy electroplating is carried out using electroplating chemicals produced by Nippon Metal Plating Co., Ltd. A Sn alloy plating layer (underlayer plating layer) is formed.

[0039] Next, Zn electroplating is performed to form an upper layer plating layer, and a lead wire having a double-layer structure plating layer is formed. Then, stretching, rolling, and electrical annealing were performed by the above-mentioned stretching calender to produce a flat cable.

Embodiment 3

[0041] After pretreatments such as electrolytic degreasing and pickling, the copper wire (conductive substrate) with a diameter of 0.6mm is subjected to Sn Cu alloy plating using a plating solution produced by Uemura Industry Co., Ltd. (Japanese name: Uemura Industry) to form a Sn alloy plating layer (bottom plating).

[0042] Next, Zn electroplating is performed to form an upper layer plating layer, and a lead wire having a double-layer structure plating layer is formed. Then, stretching, rolling, and electrical annealing were performed by the above-mentioned stretching calender to produce a flat cable.

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PUM

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Abstract

The invention provides a wire for electronic components, comprising: a conductive substrate (1), a Sn alloy plating layer (2) of Sn and Bi, Cu, Ag or Sn and Zn covering its surface (front side), and forming a Zn alloy coating layer (2) on its upper layer. Plating layer, Ag plating layer, SnZn alloy plating layer, SnAg alloy plating layer, or upper layer plating layer of SnBi alloy plating layer (3). The concentration of Bi, Cu, Ag or Zn is set at 0.1 to 15% by weight, and the total thickness of the Sn alloy plating layer (2) and the upper layer plating layer (3) is set at 0.5 to 20 μm. Thereby, a lead wire for an electronic component having a tin-based plating layer, no toxic lead at all, low cost, and capable of reliably preventing whisker generation, and a flat cable composed of the lead wire are provided.

Description

technical field [0001] The present invention relates to a lead wire for electronic components and a flat cable using the lead wire. More specifically, the present invention relates to lead wires and flat cables for electronic components that do not use toxic lead and have an effect of preventing short-circuit causes. Background technique [0002] Sn (tin) plating is widely used as a protective film for improving solderability or a protective film for an anti-corrosion coating in parts for weak current industries, parts for electronic industries, and the like. [0003] It is known that whiskers (whiskers) occur in Sn (tin) plating, and for example, in flexible flat cables in which the intervals between flat cables are extremely small, the whiskers may cause short circuits. [0004] As measures to prevent this short circuit, there are methods of performing heat treatment such as annealing treatment, and replacing the Sn plating with another plating protection film such as gol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/02C23C30/00H01B13/00H01L23/48
CPCH01L24/45H01L2224/45147H01L2224/45014H01L2224/45565H01L2224/45572H01L2224/45015H01L2224/45H01L2924/00011H01L2924/00014H01L2924/00H01L2924/013H01L2924/01023H01L2924/00013H01L2924/0103H01L2924/0105H01L2924/01015H01L2924/00012H01L2924/01033H01L2224/43848
Inventor 中村雅一
Owner MISUZU CORP
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