Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic assembly wire and flat cable comprising same

A technology of electronic components and flat cables, which is applied in the field of flat cables, can solve the problems of prevention of whiskers, insufficient, high cost, etc., and achieve the effect of preventing and suppressing whiskers

Active Publication Date: 2010-08-18
MISUZU CORP +1
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is not possible to sufficiently prevent the generation of whiskers by only performing such conventional heat treatment.
Furthermore, gold plating and the like do not generate whiskers, but the cost is too high, and SnPb alloy plating is not preferable from the viewpoint of environmental protection because lead is used.
Therefore, in recent years, SnBi (bismuth) alloy plating is attracting people's attention (for example, referring to Patent Document 1), but it is still not enough to prevent whiskers from occurring.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic assembly wire and flat cable comprising same
  • Electronic assembly wire and flat cable comprising same
  • Electronic assembly wire and flat cable comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

Embodiment 2

Embodiment 3

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a conductor of electronic part, which comprises the following parts: conductive base (1), Sn alloy coating layer (2) with Sn and Bi, Cu, Ag or Sn and Zn on the positive layer of conductive base (1), upper coating layer (3) with Zn coating layer, Ag coating layer, SnZn alloy coating layer, SnAg alloy coating layer or SnBi alloy coating layer on the surface of Sn alloy coating layer (2), wherein the density of Bi, Cu, Ag or Zn is 0.1-15%; the total thickness of Sn alloy coating layer (2) and upper coating layer (3) is 0.5-20 mum.

Description

technical field The present invention relates to a lead wire for electronic components and a flat cable using the lead wire. More specifically, the present invention relates to lead wires and flat cables for electronic components that do not use toxic lead and have an effect of preventing short-circuit causes. Background technique Sn (tin) plating is widely used as a protective film for improving solderability or a protective film for an anti-corrosion coating in parts for weak current industries, parts for electronic industries, and the like. It is known that whiskers (whiskers) occur in Sn (tin) plating, and for example, in flexible flat cables in which the intervals between flat cables are extremely small, the whiskers may cause short circuits. As measures to prevent this short circuit, there are methods of performing heat treatment such as annealing treatment, and replacing the Sn plating with another plating protection film such as gold plating or SnPb alloy plating....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/02C23C30/00H01L23/48H01B13/00
CPCH01L24/45H01L2224/45147H01L2224/45014H01L2224/45565H01L2224/45572H01L2224/45015H01L2224/45H01L2924/00011H01L2924/00014H01L2924/00H01L2924/013H01L2924/01023H01L2924/00013H01L2924/0103H01L2924/0105H01L2924/01015H01L2924/00012H01L2924/01033H01L2224/43848
Inventor 中村雅一
Owner MISUZU CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products