Circuit board of electronic device and mfg method thereof

Abstract

Structure of the disclosed circuit board includes an insulator and a first conductor. The insulator possesses a first up surface, a first low surface and a broadside. The first conductor possesses a first up surface, a first low surface and a broadside. The insulator clothes the first conductor so that at least part of first broadside of the first conductor is built in the insulator; at least part of first up surface of the first conductor is protruded and exposed out of the first up surface of the insulator; and at least part of first low surface of the first conductor is exposed out of the first low surface of the insulator. The first conductor is not prepared from conductive paste, using characteristic of solid conductor, the invention prevents rimose phenomena happened in conductive path on general circuit board. The invention increases reliability and saves materials.

Description

technical field [0001] The invention relates to a circuit board and an electronic device made using the circuit board, in particular to a circuit board and a manufacturing method of an electronic device that can improve product quality reliability and save materials. Background technique [0002] Such as Figure 18 Shown is conventional electronic device 9, which includes: a circuit board 1 with an insulator 30, a first conductor 7, a second conductor 8 and a conductive path 5, wherein the insulator 30 has a first upper surface 31, The first lower surface 32 and the accommodating space 14, the accommodating space 14 is located on the first upper surface 31 of the insulator 30, the first conductor 7 is arranged around the periphery of the accommodating space 14, and the second conductor 8 is arranged on the first lower surface of the circuit board 1 On the surface 32 , the first and second conductors 7 and 8 are electrically connected by the conductive path 5 , so that electr...

AI Technical Summary

Problems solved by technology

In the process of bonding the conductive member 60, the circuit board 1 usually needs to be heated to 140-300° C. to facilitate the bonding operation of the conductive member 60. Although the conductive paste (filler 43) is filled in the through hole of the conductive path 5 6 to increase the strength of the conductive path 5, but because the melting point temperature of the conductive paste is only 183°C, the conductive paste will become soft during the heating of the circuit board 1, so that the conductive member 60 cannot be bonded to the conductive path 5 and must be Bonded on the first conductor 7, so the circuit board 1 must be provided with the first conductor 7, thus increasing the cost and limiting the practicability of the circuit board 1

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