Pyramid-shaped capacitor structure and method of manufacturing thereof

Abstract

The invention relates to a pyramidal capacitor structure and its manufacturing method. The capacitor structure which has a generally pyramidal or stepped profile is aimed to prevent or reduce dielectric layer breakdown. The capacitor structure includes a first conductive layer, at least one dielectric layer having a first area provided on the first conductive layer and a second conductive layer provided on the at least one dielectric layer. The second conductive layer has a second area which is less than the first area of the at least one dielectric layer. A method of fabricating a capacitor structure is also disclosed.

Description

technical field [0001] The present invention relates to a semiconductor device, and more particularly to a generally pyramid-shaped capacitor structure characterized by relatively high resistance to edge breakdown in semiconductor devices. Background technique [0002] In the manufacture of semiconductor integrated circuits, metal conductor lines are used to interconnect (Interconnect) multiple components in the component circuits on the semiconductor wafer. The general process used to deposit a metal conductor pattern on a semiconductor wafer includes: depositing a conductor layer on a silicon wafer substrate; using standard lithography techniques to form a photoresist or other masks, such as titanium oxide or silicon oxide; subjecting the wafer substrate to a dry etch process to remove the conductor layer from areas not covered by the mask, leaving a masked metal layer in the form of a conductor line pattern; and Typically, reactive plasma and chlorine gas are used to rem...

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Problems solved by technology

[0010] It can be seen that the above-mentioned existing capacitor structure and its manufacturing method obviously still have inconvenience and defects in structure, method and use, and need to be further improved urgently.

In order to solve the problems existing in the capacitor structure and its manufacturing method, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure for general products to solve the above problems. , this is obviously a problem that relevant industry players are eager to solve

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