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Device and method for cutting substrate

A substrate and cutting line technology, which is applied in the field of substrate cutting devices and mother substrates of liquid crystal displays, can solve problems such as deformation, horizontal distortion of conveyors, damage depth separation, etc.

Inactive Publication Date: 2006-07-05
LG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the part with higher damage depth will be separated during the scribing process
In addition, conveyor support beams and beam support bar frames can deform due to vibration, causing the conveyor to twist horizontally

Method used

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  • Device and method for cutting substrate
  • Device and method for cutting substrate
  • Device and method for cutting substrate

Examples

Experimental program
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Embodiment Construction

[0043] Preferred embodiments of the present invention illustrated in the accompanying drawings will be specifically described below.

[0044] Figure 4A is a cross-sectional view showing a substrate cutting device according to an embodiment of the present invention, and Figure 4B yes means Figure 4A Plan view of the substrate cutting setup shown in . see Figure 4A and 4B , a substrate cutting apparatus includes first and second belt conveyors 300 and 400 disposed apart from each other by a predetermined distance to load and convey a mother substrate 200 to be cut. For example, the first and second belt conveyors 300 and 400 may be separated by about 15 centimeters from each other. The substrate cutting device also includes a drive unit 500 provided at ends of the first and second belt conveyors 300 and 400 to drive the first and second belt conveyors 300 and 400, respectively, and provided at the first and second Between the belt conveyors 300 and 400, a scriber 600 f...

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Abstract

An apparatus for cutting a substrate includes first and second belt conveyers for conveying the substrate thereon, a scriber for scribing the substrate along a cutting-reserved line, the scriber provided between the first and second belt conveyers and being spaced apart from the first and second belt conveyers, and a substrate support for securing the substrate, the substrate support provided between the first and second belt conveyers along a scribing direction of the substrate.

Description

[0001] This application claims the benefit of Korean Patent Application No. P2004-112867 filed in Korea on December 27, 2004, the entire contents of which are hereby incorporated by reference. technical field [0002] The invention relates to a liquid crystal display device, in particular to a device and method for cutting a substrate. Although the invention is suitable for a wide range of applications, it is particularly suitable for cutting mother substrates for liquid crystal displays. Background technique [0003] Due to the rapid development of the information communication field, display devices for processing and displaying information are being continuously developed. Cathode ray tubes (CRTs) have gained popularity as information displays because of their excellent screen brightness and ability to display a variety of colors. However, with increasing demands for wide screens, portability, and high resolution, recent research and development is directed toward replac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D7/27B26D7/01B26D7/08B65H20/06
CPCG02F1/133351C03B33/03B65G2249/04B28D5/0082B28D5/0011C03B33/07C03B33/033Y02P40/57Y10T225/325Y10T225/12Y10T83/0385Y10T83/0333Y10T83/04G02F1/13
Inventor 金正植
Owner LG DISPLAY CO LTD
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