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A conductive composition and method of using the same

A conductive composition, conductive metal technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc.

Inactive Publication Date: 2006-06-14
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, prior art conductive compositions requiring curing have relied on heating at very high temperatures through conventional furnaces or ovens

Method used

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  • A conductive composition and method of using the same
  • A conductive composition and method of using the same
  • A conductive composition and method of using the same

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Embodiment Construction

[0022] The following description is what is presently believed to be the best mode of carrying out the invention. This description is made to illustrate the general principles of the invention and is not to be considered limiting. The scope of the invention is best determined by reference to the appended claims.

[0023] The invention discloses a conductive composition and a method for using the conductive composition. Referring particularly to FIGS. 1A and 1B , the conductive composition is typically applied to a substrate, preferably a non-conductive substrate such as a PCB, to form conductive traces 10 . PCBs can be manufactured, inter alia, from low melting temperature plastics such as polystyrene, which are not ideal for placement in conventional furnaces or ovens. It is understood that conductive traces 10 may be deposited on a wide variety of substrates. In other words, the substrate can be any type of substrate, from a PCB to even a layer of another composition such...

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Abstract

A conductive composition comprising a conductive metal, a first resin component, and a second resin component (which is an isocyanate component) reactive with the first resin component. Metal oxides and lubricants are present as impurities on the metal surface. The second resin component is blocked at a first temperature and deblocked at a second temperature higher than the first temperature to produce first and second fluxes. The first flux reacts with the lubricant to at least partially remove oxides and lubricant from the metal surface. Removing or washing oxides and lubricants from the metal increases the conductivity of the composition. The process of depositing traces of the composition on the substrate and heating the composition to a second temperature causes decapping of the resinous components.

Description

technical field [0001] The present invention generally relates to conductive compositions and methods of using the same. More specifically, the present invention relates to conductive compositions for use in depositing conductive metal traces on printed circuit boards (PCBs) to connect electronic and electrical components into circuits, and in the manufacture of electronic and electrical components Attach the die to the leadframe. Background technique [0002] Conductive compositions (also known in the art as conductive inks) are known in the art. Methods of using conductive compositions are also known in the art. For example, the conductive composition is used to form conductive metal traces on a substrate such as a PCB. To conduct electricity, the conductive composition includes conductive metal particles. Typically these particles are in powder or flake form. As an example of a conductive metal particle, silver flakes are excellent conductors and are preferred for us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22C08K3/08
Inventor H·P·克雷格D·L·斯蒂尔
Owner DOW CORNING CORP
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