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LED device and packing method thereof

A technology of LED device and packaging method, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as limited improvement, and achieve the effect of enhancing lighting intensity and improving luminous efficiency.

Inactive Publication Date: 2006-06-14
深圳市明连兴光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the existing packaging structure makes the heat dissipation of the LED die completely based on heat conduction, so that the improvement in the effect of the structural change in the small space of the bracket is very limited. These difficulties have become obstacles to the further development of packaging technology and bottleneck
Although the most advanced stent packaging structure is still capable of heat dissipation for chips below 40 lumens / watt and 300mW, with the continuous research and development of higher power chips, and large-scale, intensive, high-intensity indoor and outdoor lighting The needs of development are bound to put forward essential breakthroughs and innovation requirements for traditional packaging technology

Method used

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  • LED device and packing method thereof
  • LED device and packing method thereof

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Embodiment Construction

[0022] The invention provides an LED device with a liquid packaging structure and a packaging method thereof. The basic structure of the LED device includes LED tube cores, electrodes, light-transmitting shells and encapsulation liquid. The conductive end of the LED die is connected to an electrode, the light-transmitting housing seals the LED die and the encapsulation liquid, and the electrode passes through the housing to connect the LED die to an external circuit. The encapsulation liquid is a light-transmitting liquid with a high resistivity, and its resistivity is much larger than the conduction resistivity of the LED die.

[0023] The LED tube core in the present invention can adopt those existing materials and structures, and can be a single tube core or a combination of multiple tube cores, such as a plurality of tube cores connected in series or in parallel in a package structure. Same-color or different-color dies. The integrated die structure described in the Chin...

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Abstract

The invention discloses a LED packaging method, sealing LED core with a light transmitting case filled with packaging liquor, leading its conductive ends out of the case, where the packaging liquor is light-transmitting liquor with large resistivity far greater than conductivity resistivity of the LED core. The invention provides the LED devices adopting the packaging method. The advantages of the invention lie in replacing liquid packaging technique with routine all solid structure, able to cool the LED core by double modes of electrode conduction and packaging liquor convection, and opening up a new developing road for high power LED packaging.

Description

【Technical field】 [0001] The invention relates to LED packaging technology, in particular to an LED device and a packaging method thereof. 【Background technique】 [0002] Since Edison invented the electric light in 1879, this great creation has brought mankind into a new century full of light and infinite possibilities. The emergence of artificial light sources has been recognized by the international scientific and technological circles as a milestone in the beginning of modern civilized society. From the earliest carbon filament lamps with a lifespan of only 8 hours, to incandescent tungsten filament lamps, fluorescent lamps excited by high-voltage fluorescence, high-pressure sodium lamps that emit light using atomic spectral line transitions, mercury lamps, spiral energy-saving lamps, etc., lighting fixtures based on various light-emitting principles can be described as The variety is complete and the patterns are various. However, the long life, high light intensity and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/64
CPCH01L33/56H01L33/648
Inventor 吕大明
Owner 深圳市明连兴光电科技有限公司
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