Method of atmospheric pressure plane discharge chemical gaseous phase depositing nano-particular film and its device

Abstract

The invention relates to an atmosphere pressure plane discharging chemical vapor deposition nanometer membrane granulose method and equipment. Its features are setting airflow divider in the reactor to make airflow uniformly flow through the discharging area and form film; setting different plane discharging unit in the reactor, increasing and reducing the cross distance to adjust deposited film component, and form crystalline state film; applying static high-voltage field to adjust forming predecessor and spatial configuration to adjust and control the film growth appearance.

Description

technical field [0001] The invention relates to an atmospheric pressure gas discharge plasma-enhanced chemical vapor deposition (AP-PECVD) film method, in particular to an atmospheric pressure plane discharge method that uniformly deposits the same composition on the surface of various materials including soft materials and has certain crystallization characteristics Nanoparticle film method and device. Background technique [0002] Low-pressure gas discharge non-equilibrium plasma technology has a very mature application in material surface treatment and thin film preparation, but if the process of continuous treatment or deposition is realized on the surface of materials such as polymers, fabrics and paper, it requires a large volume of manufacturing Vacuum chamber or tunnel kiln system with graded pre-vacuum and high vacuum, which brings great inconvenience to this type of application and greatly increases the process cost; Atmospheric pressure gas discharge non-equilibri...

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Problems solved by technology

The main problem of the above-mentioned first method is that the glow discharge can only be generated in a small electrode gap (less than 5mm) under atmospheric pressure, and the gas and power parameters of the glow discharge allow a very limited range of adjustment. The above conditions With a slight change, the atmospheric pressure glow discharge will transform into a streamer discharge and may damage the surface of the substrate

In addition, since the gas flows through the discharge area from one side of the discharge area, the particle diameter of the film layer on the surface of the substrate and the distribution of the film layer components along the gas flow direction are not uniform.

At present, atmospheric pressure glow discharge-induced chemical vapor deposition is limited to small devices in the laboratory, and the research on the discharge mechanism and the deposition of functional thin films is mainly carried out. The generation of large-area glow discharge and the treatment or deposition of large-area material surfaces have not been seen yet. Report on Membrane Technology

The second method is to rely on the highly excited species in the discharge gas to react with the chemical gas of the deposited film. Although the direct contact between the surface of the material and the discharge area is avoided, the collision occurs during the transport from the discharge area to the reaction area under the atmospheric pressure environment. De-excitation, the density of excited species reaching the reaction area and participating in the reaction is much lower than that of the discharge area, so the rate and energy efficiency of the deposited film are greatly reduced

The films deposited by the above two methods are generally amorphous. If there is a requirement for the crystalline state of the film (such as TiO for photocatalysis 2 ), then the substrate needs to be heated during the film deposition process, or the deposited film layer should be post-treated at a higher temperature in order to realize the film transition from amorphous to crystalline state. This process method is suitable for soft materials Depositing a nanoparticle film on the surface cannot achieve the transformation of the film structure

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