Closed loop cycle type heat sink and screen module using the same

Abstract

The close-loop circulation heat-sink device comprises: one or complex strips metal guide pipes to conduct out the heat gas from upper outlet of shell, and complex radiating fins connected to said pipe for heat exchange by thermal convection or radiation to cool the heat gas in pipes to conduct back to lower inlet of shell; thereby, forming a close-loop heat sink circulation, and reducing temperature inside screen module. This invention provides sufficient heat sink capacity without added gas or liquid compression and dynamic device or element. Additionally, the interior gas does not convect with exterior, but depends on natural heat sink circulation in system.

Description

technical field [0001] The present invention relates to a cooling device, in particular to a closed-loop circulating cooling device capable of exporting hot air inside a system for natural cooling circulation, and a screen module using the cooling device. Background technique [0002] With the continuous advancement of large-scale integrated circuit technology, the electronic industry has achieved rapid and long-term development. Electronic products are developing towards high density and high speed. The biggest problem derived is to solve the problem of heat dissipation; Higher and higher, the requirements for the picture quality, contrast, resolution and size of the display are also continuously improved. Therefore, the heat generated along with it is also increasing. If the heat is not dissipated in time, it will cause the display inside The temperature rises rapidly, which seriously affects the stability and service life of its display. [0003] Nowadays, new displays a...

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Problems solved by technology

[0005] The above two heat dissipation methods can only dissipate the local heat of the screen module, and it is impossible to effectively reduce the heat generated by the heat source inside the screen module, so that it is impossible to solve the problem of the screen module. The problem of temperature balance inside and outside the panel means that the external temperature of the screen module can be reduced due to the auxiliary heat dissipation of heat dissipation fins or heat pipes; but the closer to the heat source inside the screen module, the lack of The temperature cannot be lowered due to the heat dissipation device, so the internal and external temperature balance of the screen module is still lacking and needs to be improved

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