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Electronic apparatus

A technology of electronic equipment and main body, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of increased weight, poor cooling efficiency, and increased overall size

Inactive Publication Date: 2006-03-01
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the heat dissipation plate 53 and the heat dissipation pipe 54 for cooling are additionally required, the thickness of the housing 52 on the LCD side increases, so that the overall size of the electronic device inevitably increases, and there is also a problem of an increase in weight.
Moreover, in the cooling structure shown in FIG. 1, since heat is dissipated through the tube wall of the heat pipe 54 and the heat dissipation plate 53, there is a problem of poor cooling efficiency.

Method used

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Embodiment Construction

[0025] The invention will be described in detail below with reference to the accompanying drawings showing some embodiments thereof. figure 2 is a perspective view showing the electronic device of the present invention. The electronic device is, for example, a notebook computer, but in figure 2 The LCD display panel is not shown.

[0026] exist figure 2 Among them, the electronic device of the present invention includes a housing 1 (hereinafter referred to as a first housing 1) on the main body side and a housing 2 (hereinafter referred to as a second housing 2) on the cover body side. In the first casing 1 and the second casing 2, a passage 10 for circulating a coolant such as water is formed (in figure 2 the part indicated by the thick line).

[0027] In the first housing 1, the channel 10 is provided near the MPU element 11 which generates considerable heat. A heat receiving plate 12 is provided for the MPU element 11 so that the heat generated by the MPU element 11 is...

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Abstract

A small-size and light-weight electronic apparatus with a cooling structure capable of exhibiting good cooling performance is provided. A cover member with a plurality of grooves for forming a channel is joined by brazing to a housing on a lid body side to which an LCD panel is attached, and these grooves are covered with the housing to form a channel for circulating a coolant. The housing constitutes a part of the channel, and the channel for the coolant is integrated into the housing. Heat generated by a main body is transferred to the lid body side by the coolant and dissipated outside through the housing that performs the function of a heat-radiation plate.

Description

technical field [0001] The present invention relates to an electronic device for dissipating heat by using a circulating coolant. Background technique [0002] Electronic devices such as desktop computers, notebook computers and mobile communication devices have microprocessors (MPUs). As the processing speed, functionality, and performance of microprocessors have increased in recent years, the amount of heat generated during operation has continued to increase. In order for microprocessors to maintain stable operation, thermal performance must be improved by rapidly dissipating the heat generated from these devices. [0003] Therefore, electronic equipment is generally equipped with an air-cooling type cooling device for cooling the microprocessor. The cooling device includes a heat sink for absorbing heat generated by the microprocessor and dissipating the heat, and a cooling fan for sending cooling air to the heat sink. As described above, since it is expected that the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06K1/20
CPCH01L2924/0002H01L23/473H01L2924/00G06F1/20
Inventor 徳平英士伊达仁昭内田浩基石锅稔
Owner FUJITSU LTD
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