Semiconductor device

Abstract

Suppression of increase in size of semiconductor devices and reduction of noise. A semiconductor device comprises: a substrate (5), surface layers (9, 11) are respectively provided on both sides of a substrate core layer (7) made of a printed circuit board; semiconductor elements (1) are mounted on the substrate (5 )superior. The semiconductor element (1) is connected to one of the surface layers (9) by a connector (3), and an outer lead terminal (55) is arranged on the other surface layer (11). Through holes (41, 43, 45, 75, 77) are made in the core layer (7) to electrically connect the semiconductor element (1) with the outer lead terminal (55). The vias (41, 43, 45, 75, 77) comprise arrayed vias (41, 43, 45) arranged in accordance with the outer via array (55), one or more additional vias (75, 77) made in Between the arrayed through holes (41, 43, 45).

Description

technical field [0001] The present invention relates to semiconductor devices. Background technique [0002] Ball Grid Array Semiconductor Devices (hereinafter referred to as BGA Semiconductor Devices), Grid Pin Array Semiconductor Devices (hereinafter referred to as PGA Semiconductor Devices), Land Grid Array Semiconductor Devices (hereinafter referred to as LGA Semiconductor Devices), Chip Size Packaged semiconductor devices (hereinafter referred to as CSP semiconductor devices), etc., in which the lead terminals are made in the form of a grid, because this form can increase the number of signal lines, plus other reasons, it has been widely used. [0003] In these semiconductor devices, in order to reduce electrical noise, in addition to the first ground vias electrically connected to the ground plane, it has been proposed to provide a plurality of second ground vias, which are connected to the ground plane in the ground pattern provided at the predetermined position on th...

AI Technical Summary

Problems solved by technology

[0004] However, in these semiconductor devices, a ground pattern is provided around each electrode, and a second ground via hole electrically connected to the ground layer is formed in the ground pattern, so the semiconductor device becomes large due to the amount of ground patterns provided.

Some problems arise when the semiconductor device becomes larger: the cost of the semiconductor device increases and the mounting area increases, thereby increasing the cost of the electronic device incorporating the semiconductor device

Images