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Method for manufacturing air bridge by composite glue electric-plating

A composite glue and air bridge technology, which is applied to electrical components, chemical/electrolytic methods to remove conductive materials, circuits, etc., can solve problems such as corrosion, incompleteness, wrinkling and peeling of plating layers, etc.

Inactive Publication Date: 2005-07-20
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The object of the present invention is to provide a method for making an air bridge by composite glue electroplating, which has the advantages of 1. using the method of stripping to remove the simplified process steps of the coating; 2. avoiding the corrosion of the underlying metal by the electroplating process; 3. solving the problem of single-layer glue A series of problems such as coating wrinkling and incomplete peeling

Method used

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  • Method for manufacturing air bridge by composite glue electric-plating
  • Method for manufacturing air bridge by composite glue electric-plating
  • Method for manufacturing air bridge by composite glue electric-plating

Examples

Experimental program
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Effect test

Embodiment 1

[0042] Step 1, coating compound glue 6 on the substrate 3

[0043] First apply PMMA (Polymethylmethacrylate) glue, and then 9918 glue, of which PMMA (Polymethylmethacrylate) is about 1000 , because PMMA (Polymethylmethacrylate) is high temperature Glue can avoid the problems of glue cracking, denaturation, and dryness caused by high temperature in the whole production process. The use of this composite glue 6 successfully solves the wrinkling of the coating 7 ( Figure 19 ) problem, and played a very important role in the complete stripping of the coating 7, obviously, using the stripping effect of the composite glue 6 ( Figure 21 ) is better than using a single layer of glue 5 ( Figure 20 ) is much better. The thickness of the 9918 glue depends on the height of the arch of the air bridge 2. If the glue is relatively thick, it needs to be glued twice, and the hardening time should be prolonged appropriately.

[0044] Step 2. Bake at high temperature to make the edges and...

Embodiment 2

[0058] Step 1, coating compound glue 6 on the substrate 3

[0059]First apply PMMA (Polymethylmethacrylate) glue, and then 9918 glue, of which PMMA (Polymethylmethacrylate) is about 1000 , because PMMA (Polymethylmethacrylate) is high temperature Glue can avoid the problems of glue cracking, denaturation, and dryness caused by high temperature in the whole production process. The use of this composite glue 6 successfully solves the wrinkling of the coating 7 ( Figure 19 ) problem, and played a very important role in the complete stripping of the coating 7. Obviously, the stripping effect of using the composite glue ⑥ ( Figure 21 ) is better than using a single layer of glue 5 ( Figure 20 ) is much better. The thickness of the 9918 glue depends on the height of the arch of the air bridge 2. If the glue is relatively thick, it needs to be glued twice, and the hardening time should be prolonged appropriately.

[0060] Step 2. Bake at high temperature to make the edges and ...

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Abstract

The invention relates to a compound glue electroplating making air bridge method. Its features are that it including the following steps that the compound glue is plated on the base piece, and photo etching pier; high temperature roasting to make the rim angle of the compound glue smooth; start coating is spattered on the compound glue; the start coating is coated second photoresist, and photo etching floor; after this, the start coating is plated metal; peeling off the start coating under the photo etching to make it reveal the tow side base piece to form air bridge.

Description

technical field [0001] The invention relates to a new electroplating method for manufacturing air bridges applied in the manufacturing process of semiconductor devices-a method for manufacturing air bridges by composite glue electroplating. Background technique [0002] In microwave solid-state integrated circuits, due to the consideration of circuit or device performance, air bridge wiring is often used at the wiring intersection to reduce overlapping capacitance. Air bridges can be prepared by evaporating metal and electroplating, but the process is more complicated. , It needs to carry out multiple photolithography, electroplating to make the air bridge has the advantages of high strength, and can be thickened with the metal at the same time, so it is widely used. [0003] In the current domestic process flow, the photolithography plate used for electroplating to make air bridges is shown in Figure 1. The main process flow is as follows: [0004] 1. Apply glue, photo-etc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/288H01L21/445H05K3/06
Inventor 邵刚刘新宇和致经刘键吴德馨
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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