Adhesive tape

A technology of adhesive tape and adhesive, applied in the direction of adhesive type, ester copolymer adhesive, acid copolymer adhesive, etc., can solve the problem of residual slurry, etc., and achieve good pick-up and slicing characteristics Excellent, the effect of suppressing the increase of adhesive force

Inactive Publication Date: 2011-01-05
NITTO BELGIUM NV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is also the problem of residual slurry under long-term storage

Method used

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  • Adhesive tape
  • Adhesive tape
  • Adhesive tape

Examples

Experimental program
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Effect test

Embodiment 1

Embodiment 2

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Abstract

The invention provided an adhesive tape that can satisfy the contradictory characteristics of an initial adhesive property and adhesive force that is stable with time and does not have problems related to surface contamination in the adhesive tape using soft polyvinyl chloride containing plasticizer as a support. The adhesive tape has an adhesive layer that is formed on one surface or both the surfaces of the support by the adhesive containing base polymer, and a cross-linking agent. The support contains soft polyvinyl chloride containing plasticizer, the adhesive on at least one surface contains acryl-based polymerization polymer having a carboxyl group as the base polymer. The adhesive tape contains an isocyanate-based cross-linking agent as a cross-linking agent, a glycidylamine-based cross-linking agent, and a melamine-based cross-linking agent.

Description

adhesive tape technical field The present invention relates to an adhesive tape (apressure-sensitive adhesive tape). The adhesive tape of the present invention can be used for various purposes. The pressure-sensitive adhesive tape of the present invention has the characteristics of excellent initial adhesiveness and less increase in adhesive force over time, and can be used for the purpose of re-peeling. In addition, the present invention also relates to an adhesive (apressure-sensitive adhesive agent) used in the above-mentioned adhesive tape. The adhesive tape of the present invention can be used as an adhesive tape used in a semiconductor wafer slicing step. The adhesive tape used in the above-mentioned dicing process can be used as an adhesive tape for dicing to fix the diced object such as a semiconductor wafer when cutting and separating (slicing) small pieces of components such as a semiconductor wafer, and can also be used as an adhesive tape for dicing. The adhes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C08K5/00C09J7/22C09J7/38C09J133/02C09J133/10C09J133/12C09J161/28C09J163/00C09J175/04H01L21/301
CPCC09J7/0217C09J7/0246C09J2433/00C09J2203/326C08K5/0025C09J2427/006C09J7/38C09J7/385C09J7/22C08L33/08C09J7/245
Inventor 铃木俊隆安·伊萨里斯埃德温·蒂斯瓦尔特·埃韦尔斯山本昌司
Owner NITTO BELGIUM NV
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