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Non-aqueous solvent cyanogens-free gold plating solution

A non-aqueous solvent, cyanide-free gold plating technology, applied in the field of gold plating solution, can solve the problems of environmental pollution, hydrogen evolution, cracking or dissolution, etc., and achieve the effect of good conductivity, low toxicity and high polarity

Inactive Publication Date: 2004-11-03
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Modern gold plating technology mainly uses cyanide plating solution, in which the solvent is water. The fatal disadvantage of this gold plating solution is its high toxicity, which is harmful to human health and pollutes the environment.
For the electronics industry, it is necessary to use photoresist for selective electroplating, and cyanide has a degrading effect on it, and it is easy to crack or dissolve it; in addition, it is not easy to obtain a spherical crystal coating during electroplating
The currently used non-cyanide plating solution, such as gold sulfite, is very limited in application due to its low stability.
Water is usually used as the electroplating solvent, but there are few gold sources that can dissolve in water, and sometimes hydrogen evolution is easy to occur, so it is difficult to obtain a gold coating with spherical crystals
The literature report about non-aqueous solvent gold-plating solution is less, representative, the one is the Japanese research paper ("Hyomen Gijutsu ", 46 (12), 1182-4 (Japanese) 1995) of 1995; The 2nd, 1997 Japanese patent JP09031681 (patent open 9-31681, open date on February 4th, 1997), though both adopt non-aqueous solvent system, still use highly toxic cyanide bath and less stable chloraurate bath gold plating

Method used

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  • Non-aqueous solvent cyanogens-free gold plating solution
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  • Non-aqueous solvent cyanogens-free gold plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] (1), Research electrode: 12mm×14mm, copper sheet with a purity of 99.5%, use 500 # , 800 * , 1200 # Imported metallographic sandpaper successively grinds off the oxide film on the copper surface, polishes on a grinder equipped with fine felt cloth, washes with alkali, pickles, washes with distilled water, and blows dry.

[0050] (2) Counter electrode: 10mm×12mm, 99.9% pure gold sheet.

[0051] (3), reference electrode; saturated Ag / AgCl electrode.

[0052] (4), solvent DMSO, gold source AuPPh 3 Cl, supporting electrolyte NH 4Cl. The composition and concentration of the plating solution are:

[0053] Composition Maximum Concentration Range Optimal Concentration Range Optimal Concentration

[0054] (mol / l) (mol / l) (mol / l)

[0055] DMSO

[0056] AuPPh 3 Cl 0.005~0.04 0.008~0.03 0.015

[0057] NH 4 Cl 0.05~0.3 0.1~0.3 0.2

[0058] Add AuPPh to 20ml DMSO 3 Cl, NH 4 Cl to the above concentration range, stirring, the current density is 0.01A / dm ...

Embodiment 2

[0060] Take sample electrode according to embodiment 1, solvent DMSO, gold source AuPPh 3 Br, supporting electrolyte NH 4 Br, glossy coating, golden yellow.

[0061] The composition and concentration of the plating solution are:

[0062] Composition Maximum Concentration Range Optimal Concentration Range Optimal Concentration

[0063] (mol / l) (mol / l) (mol / l)

[0064] DMSO

[0065] AuPPh 3 Br 0.005~0.04 0.008~0.03 0.015

[0066] NH 4 Br 0.05~2.0 0.1~0.5 0.2

Embodiment 3

[0068] According to the plating condition of embodiment one, solvent DMSO, gold source AuPPh 3 I, supporting electrolyte NH 4 I, coating luster, golden yellow.

[0069] The composition and concentration of the plating solution are:

[0070] Composition Maximum Concentration Range Optimal Concentration Range Optimal Concentration

[0071] (mol / l) (mol / l) (mol / l)

[0072] DMSO

[0073] AuPPh 3 I 0.005~0.04 0.008~0.03 0.015

[0074] NH 4 I 0.05~1.5 0.1~0.5 0.2

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PUM

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Abstract

The cyanide-free gold-plating solution includes non-water solvent, gold source and support electrolyte, and features the non-water solvent of DMSO, DMF or PC; gold source of AuPPh3X, where X is Cl, Br, I or acac; and the support electrolyte of inorganic or organic ammonium salt soluble in the non-water solvent, with the inorganic ammonium salt being NH4X, where X is Cl, Br or I, and the organic ammonium salt being R4NX, where R is C2H5 or n-C4H9 and X is Cl, Br or I. The present invention features the green gold-plating solution, expanded gold source owing to the non-water solvent and the spherical crystallized coating structure with excellent performance.

Description

technical field [0001] The invention relates to a gold plating solution, in particular to a non-aqueous solvent cyanide-free gold plating solution. The gold plating solution has low toxicity, high gold source concentration, no need for additives, no hydrogen evolution effect, and the coating has excellent performance. Spherical crystal. Background technique [0002] Among metal coatings, gold is the most corrosion-resistant, has good electrical and thermal conductivity, and high temperature resistance. Therefore, its application in printed circuit boards, integrated circuits, tube shells, and electrical contacts has grown rapidly in recent years. Gold plating is usually based on Cu and Ni metals, and electrolytic plating is performed in a gold plating solution. Modern gold-plating technology mainly uses cyanide plating solution, wherein the solvent is water. The fatal disadvantage of this gold-plating solution is its high toxicity, which is not only ...

Claims

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Application Information

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IPC IPC(8): C25D3/48
Inventor 顾建胜王海霞童剑英
Owner SUZHOU UNIV
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