Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

System, equipment and method for automatic testing IC complete device

A technology for integrated circuit and complete machine testing, which is applied in the direction of electronic circuit testing, non-contact circuit testing, semiconductor/solid-state device testing/measurement, etc. It can solve problems such as software conflicts, inability to control the operating temperature of components, and problems. Reach the effect of reducing the test time, ensuring the quality of use, and reducing costs

Inactive Publication Date: 2003-05-07
VIA TECH INC
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 1. The known integrated circuit test cannot simulate the final use state of the user, so even if it passes the test, problems may occur when the user uses it, such as conflicts with software, etc.
[0010] 2. The same type of components are placed on the test circuit board during the known integrated circuit test, and the compatibility problem between different components cannot be detected
[0011] 3. The known test methods still rely on a lot of labor, which limits the production capacity and cost, and also causes the possibility of human error
[0012] 4. The known test method for integrated circuit modules cannot control the operating temperature of the components after the integrated circuit is assembled, that is, at the module stage, so it cannot be simulated for certain states in actual use.
[0013] 5. After the known integrated circuit under test is tested at high temperature, the integrated circuit under test must be moved to other automatic test equipment and then tested at low temperature. This test method is not very efficient.
[0014] 6. The judgment of the known test is generally based on the final integrated circuit state, and some dynamic errors cannot be detected, such as video shaking and hue variation generated when the program is actually executed in the case of a graphics accelerator. Phenomena such as discoloring display, ghost shallow, or image errors (white block) cannot be detected
Or crashes caused by integrated circuit software execution, etc., cannot be detected by traditional testing methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System, equipment and method for automatic testing IC complete device
  • System, equipment and method for automatic testing IC complete device
  • System, equipment and method for automatic testing IC complete device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0074] The automatic integrated circuit testing system, device and method of the present invention are performed on a known good computer for testing, and can be used to test any integrated circuit in the testing computer. In the case of a personal computer, such as a central processing unit, a system bus controller, and an input / output bus controller; or an integrated circuit in an interface module, such as a graphics accelerator. Generally, these integrated circuits are configured on a printed circuit board, such as a central processing unit, a system bus controller, and an I / O bus controller are usually configured on a motherboard. Wherein, the CPU is usually electrically connected to the motherboard by means of a connector, such as Socket478, Socket 423, Socket 370, Socket 7, and the like. The memory integrated circuit is configured on a module circuit board, and then electrically connected to the motherboard by means of a connector, such as DIMM, RIMM, and the like. As f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The testing device includes the testing computer and at least one of the image-sensing device. The testing computer is used for holding and testing the IC to be tested. The testing computer combines the IC to be tested forming an integrated computer so as to carry out the integrated testing. The testing computer includes at least one output device to output the result of testing the IC. The image-sensing device can pick up the image in the outupt device and can send the image picked to the control unit where the image picked is compared with the image data stored in the database in order to find out the difference between them.

Description

technical field [0001] The present invention relates to an automated integrated circuit complete machine testing system, device and method thereof, in particular to an automated integrated circuit complete machine test system, device and method capable of simulating the state of an end user and performing dynamic testing. method. Background technique [0002] Computers have almost become one of the necessities of life for today's human beings, whether servers (servers), workstations (Workstations), desktop computers (desktop computers), notebook computers (notebook computers) or portable computers (portable computers) ), or personal digital assistant (personal digital assistant) or palm-top PC (palm-top PC) or pocket PC (pocket PC), or even industrial computer (industrial computer), has become a part of most people's daily life share. These computers are composed of many integrated circuits (ICs), and these integrated circuits must undergo complicated tests to ensure the q...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/303H01L21/66
Inventor 祁明仁郭澎嘉
Owner VIA TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products