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Connecting tape for semiconductor chip loading, carrier and package for semiconductor chip

A chip carrier and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of low yield, waste of bonding sheets, waste of cost, etc., to improve yield, prevent The effect of using waste and reducing costs

Inactive Publication Date: 2003-01-01
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the semiconductor chip loading method according to the above-mentioned steps, defective semiconductor chips that have cuts or cracks during dicing are also attached to the bonding sheet, so the yield is low and the bonding sheet is wasted.
In particular, the bonding agent for bonding sheets is a conductive product. For example, when the bonding agent contains a large amount of precious metals such as Ag powder, it will cause a lot of cost waste.

Method used

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  • Connecting tape for semiconductor chip loading, carrier and package for semiconductor chip
  • Connecting tape for semiconductor chip loading, carrier and package for semiconductor chip
  • Connecting tape for semiconductor chip loading, carrier and package for semiconductor chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0125] Production of bonding tape for mounting semiconductor chips (adhesive: composition a)

[0126] 55 parts by weight of butyl acrylate, 10 parts by weight of methyl methacrylate, 20 parts by weight of glycidyl methacrylate, and 15 parts by weight of 2-hydroxyethyl acrylate were copolymerized to prepare a copolymer having a weight average molecular weight of 900,000.

[0127] Mix 10 parts by weight of the above-mentioned copolymer, 24 parts by weight of liquid bisphenol A type epoxy resin (EPICO-TO 828 manufactured by Yuka Shell Epoxy Resin Co., Ltd.), 24 parts by weight of o-cresol novolac type epoxy resin (Nippon Kasaku Co., Ltd. EOCN-104S) 10 parts by weight, 0.05 parts by weight of γ-glycidoxypropyltrimethoxysilane as a coupling agent, 1.5 parts by weight of cyanoguanidine as a thermally active latent curing agent, 2-phenyl - 4,5-hydroxymethylimidazole, 5 parts by weight of urethane acrylate oligomer (Seikabi-M 14-29B manufactured by Dainichi Seika Co., Ltd.) as a pho...

Embodiment 2

[0132] Manufacture of bonding tape for semiconductor chip loading (adhesive: polyimide resin)

[0133] Composition a in Example 1 was replaced with a tetrahydrofuran solution (solid content: 20% by weight) of thermoplastic polyimide (UPITITO UPA-N221 manufactured by Ube Industries, Ltd.) to release one side with a silicone resin The polyethylene naphthalate (PEN) film (surface tension: 34dyn / cm) of processing replaces the PET film that one side is carried out release treatment with silicone resin in embodiment 1, except thermoplastic polyimide The drying conditions were set at 90° C. and 5 minutes, and the rest were the same as in Example 1 to prepare a bonding tape for semiconductor chip loading.

Embodiment 3

[0135] Manufacture of bonding tape for mounting semiconductor chips (adhesive: epoxy-based resin composition)

[0136] Mix 40 parts by weight of high-molecular-weight bisphenol-type epoxy resin (EPICO-TO 1010, manufactured by Yuka Shell Epoxy Resin Co., Ltd.), and 20 parts by weight of multifunctional cresol novolak-type epoxy resin (EOCN-4600, manufactured by Nippon Kayaku Co., Ltd.) Parts by weight, 1.5 parts by weight of 2-phenyl-4,5-hydroxymethylimidazole as a thermally active latent curing agent and 0.1 parts by weight of γ-glycidoxypropyltrimethoxysilane, as epoxy Resin bonding agent.

[0137] Except that the above-mentioned epoxy resin adhesive was used instead of the composition a in Example 1, the rest were the same as in Example 1, and a bonding tape for semiconductor chip loading was produced.

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Abstract

A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips 2 are intermittently formed on a tape shaped base material 11 in the longitudinal direction of the base material 11 to have a substantially identical shape with that of the semiconductor chip 2 to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions 12 has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips 2 and prevent a wasteful use of an adhesive agent.

Description

technical field [0001] The present invention relates to a bonding tape and sheet for semiconductor chip loading, a semiconductor chip carrier, a semiconductor chip package, and a semiconductor chip used when mounting a semiconductor chip on a lead frame, or when storing, transporting, or automatically taking out a semiconductor chip before that. A method for manufacturing a chip carrier, a method for mounting a semiconductor chip, and a method for packaging a semiconductor chip. Background technique [0002] Conventional techniques for mounting semiconductor chips on lead frames are performed in the following steps. [0003] 1. Grinding the back of the semiconductor wafer to make the semiconductor wafer to the desired thickness. [0004] 2. Attach the bonding sheet to the semiconductor wafer. [0005] 3. If necessary, attach an adhesive sheet for wafer dicing to fix the semiconductor wafer on the lead frame. [0006] 4. Slicing of the semiconductor wafer is carried out w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02B65D85/86C09J7/20H01L21/58H01L21/60H01L23/10
CPCH01L2924/01015H01L2924/0105H01L2924/01082H01L2221/68327H01L23/10H01L2924/16152H01L2924/01004H01L2224/97H01L2924/12041H01L21/6836H01L2924/01029H01L2224/83192H01L2924/01027C09J2203/326H01L2924/014H01L2924/01013C09J2201/28H01L2224/8385H01L24/97H01L2924/0665H01L2224/2919H01L2924/01047H01L2924/01079H01L24/83H01L2221/68359H01L24/29H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01012C09J7/02H01L2924/07802C09J7/20Y10T29/53174Y10T29/53178C09J2301/204H01L2224/83H01L2924/00H01L2924/3512
Inventor 山崎修江部和义
Owner LINTEC CORP
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