Non-volatile memory with float gate wall and its preparing process
A non-volatile, manufacturing method technology, used in semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor devices, etc.
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[0015] Figure 4 It is a cross-sectional view of a non-volatile memory structure generated in the pre-manufacturing stage. A floating gate polysilicon layer 150 self-aligned with the active region 120 is formed by known shallow trench isolation (shallow trench isolation, STI) technology, basically the same as figure 2 Similarly, in this embodiment, the substrate 130 is a suitably doped (such as doped with phosphorus) single crystal silicon substrate, and a suitable well (well) (not shown) can be formed in the substrate 130, as H.T.Tuan et al. Patent application No. 09 / 640,139 titled "Nonvolatile Memory Structures and Methods of Fabrication" (application date August 15, 2000) described in the patent, of course other types of substrates can also be used here, such as non-silicon substrates, the present The invention is not limited to a particular kind of well or doping pattern.
[0016] An insulating layer 140 is formed on the substrate 130. In this embodiment, the insulating ...
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