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Miniature overlay strain gauge

A strain gauge and miniature technology, which is applied in the direction of instruments, measuring force, measuring devices, etc., can solve problems such as abnormal resistance, failure to meet the test requirements of small-sized chips and circuit boards, and solder adhesion, so as to reduce the overall thickness and avoid soldering Adhesion phenomenon, simple effect of alignment

Pending Publication Date: 2022-08-09
ZHONGHANG ELECTRONICS MEASURING INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing overlapping strain gauges cannot meet the testing requirements of tiny chips and circuit boards. The main reason is that the spacing between the pads of each strain gauge is extremely small, and solder adhesion is very likely to occur after lead welding, resulting in abnormal resistance and other problems. And it will lead to the need for a large-sized substrate, usually 2.5mm×2.5mm and above, in order to avoid the problem of solder adhesion

Method used

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Embodiment Construction

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the The embodiments of the present invention, and all other embodiments obtained by those of ordinary skill in the art without creative work, fall within the protection scope of the present invention.

[0029] It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer" ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one...

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Abstract

The invention discloses a miniature overlay strain gauge, which comprises a plurality of layers of substrates, each layer of substrate is provided with a sensitive grid, and the included angles between the sensitive grids and the center line of the substrate are different. Each sensitive grid is provided with two bonding pads, the distance between the two bonding pads of each sensitive grid is equal, the positions of all the bonding pads are arranged on the surface of the substrate in a staggered mode, n bonding pads are arranged on different substrates in the area between the two bonding pads of each sensitive grid, and n is equal to the number of the sensitive grids minus one. Under the condition that the size of the substrate is reduced, the bonding pad distance is increased, and the soldering tin adhesion phenomenon is avoided.

Description

technical field [0001] The invention belongs to the field of foil resistance strain gauges, and relates to a miniature overlapping flower strain gauge. Background technique [0002] Foil resistance strain gauges have been widely used in the manufacture of various high-precision sensors and stress and strain testing in various environments. With the boom in consumer electronics, the use of circuit boards and integrated chips has increased dramatically. However, stress concentration or damage is very easy to occur during the transportation and installation of circuit boards and integrated chips. Therefore, a strain gauge is required to detect the stress condition of circuit boards or chips to analyze the reliability of circuit boards, so as to optimize circuit board performance. Design and transportation, packaging methods, improve the reliability of the circuit board. [0003] With the development of miniaturization of consumer electronic products, the size of the circuit b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22
CPCG01L1/22G01L1/2287
Inventor 晏志鹏雒平华赵凯锋赵恒
Owner ZHONGHANG ELECTRONICS MEASURING INSTR
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