Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Scraper device, solder paste printing equipment and manufacturing method of printed circuit board assembly

A scraper device and circuit board technology, applied in printing, printing machines, rotary printing machines, etc., can solve the problems of circuit boards being polluted by solder paste, insufficient amount of solder paste, and increased production costs

Pending Publication Date: 2022-08-05
ZTE CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in actual production, often due to the insufficient amount of solder paste in the plug-in hole, it is necessary to repeat the tin printing process to make the amount of solder paste in the plug-in hole meet the requirements of reflow soldering, there are increased production costs, and the circuit board is covered by solder paste due to repeated tin printing. Disadvantages such as pollution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Scraper device, solder paste printing equipment and manufacturing method of printed circuit board assembly
  • Scraper device, solder paste printing equipment and manufacturing method of printed circuit board assembly
  • Scraper device, solder paste printing equipment and manufacturing method of printed circuit board assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0031] It should be understood that in the description of the embodiments of the present invention, multiple (or multiple) means two or more, greater than, less than, exceeding, etc., are understood as not including this number, and above, below, within, etc., are understood as including this number. If there are descriptions of "first", "second", etc., only for the purpose of distinguishing technical features, and should not be understood as indicating or implying relative importance, or implicitly indicating the number of indicated technical features or implicitly indicating the indicated...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a scraper device, solder paste printing equipment and a manufacturing method of a printed circuit board assembly. The scraper device comprises a knife rest assembly and a blade, the blade is provided with a fixed end and a free end, the fixed end of the blade is connected with the knife rest assembly, the included angle between the free end of the blade and the steel mesh is any angle ranging from 46 degrees to 56 degrees, and the steel mesh is placed on the surface of a circuit board to be printed. The scraper device can be used for conducting solder paste scraping operation on the circuit board to be printed, in the solder paste scraping process, the included angle between the blade of the scraper device and the steel mesh is any angle ranging from 46 degrees to 56 degrees, the angle range of the included angle can ensure that enough solder paste can be scraped into a plug-in hole when the blade passes through the plug-in hole of the circuit board, and therefore the solder paste scraping efficiency is improved. And the amount of the solder paste in the plug-in hole can meet the requirement of reflow soldering in one tin printing process.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a scraper device, solder paste printing equipment and a manufacturing method of a printed circuit board assembly. Background technique [0002] In the related art, the plug-in components are usually soldered on the circuit board by means of wave soldering, which inevitably increases the wave soldering equipment and the wave soldering production process, resulting in increased production costs. In the related art, reflow soldering is also used to solder the plug-in components. In the specific implementation process, tin needs to be printed in the plug-in holes of the circuit board before the plug-in components are reflowed. However, in actual production, often due to the insufficient amount of solder paste in the plug-in hole, it is necessary to repeat the tin printing process to make the amount of solder paste in the plug-in hole meet the requirements of reflow sol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B41F15/44B41F15/08H05K3/12
CPCB41F15/44B41F15/08H05K3/12B41P2215/50
Inventor 丁建国孙磊梁志刚陈志林张龙江
Owner ZTE CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com