Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED bracket with overflow channel and overflow slot and manufacturing method thereof

A technology of LED bracket and overflow channel, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of unevenness of devices, poor thermal conductivity, etc., to improve thermal conductivity, increase pad area, and improve device process consistency sexual effect

Pending Publication Date: 2018-03-23
SHANDONG PROSPEROUS STAR OPTOELECTRONICS TECH CO LTD
View PDF7 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide an LED bracket with an overflow channel and an overflow groove and its manufacturing method, aiming to solve the problems of unevenness of the device and poor thermal conductivity in the existing LED bracket during soldering

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED bracket with overflow channel and overflow slot and manufacturing method thereof
  • LED bracket with overflow channel and overflow slot and manufacturing method thereof
  • LED bracket with overflow channel and overflow slot and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0029] see Figure 5-Figure 7 , the present invention provides an LED bracket with an overflow channel and an overflow groove, including a substrate 2, preferably, the substrate 2 is made of a copper substrate 201 molded and injected with a thermosetting resin material 202, such as EMC (Epoxy Molding Compound ), SMC (Sheet Molding Compound) and other materials. The front side of the substrate 2 is used to place LED chips. The LED chips can adopt a front-mount chip structure, a vertical chip structure or a flip-chip structure. The front area of ​​the substrate 2 is adaptively adjusted according to different chip structures. A pad 1 is provided on the back of the substrate 2, and the pad 1 is used for connecting an external circuit. Pref...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an LED bracket with an overflow channel and an overflow slot and a manufacturing method thereof. The bracket comprises a substrate. The front surface of the substrate is used for placing an LED chip. A pad is arranged on the back of the substrate and is provided with the overflow channel which is provided with an overflow slot. The invention provides the LED bracket with theoverflow channel and the overflow slot and the manufacturing method thereof, through setting the overflow channel on the pad and setting the overflow slot on the overflow channel, during the welding,excess solder paste flows into the overflow slot, the quantity of the solder paste is ensured, and the device process consistency and flatness and height consistency are improved. The area of the padis increased by the added overflow channel, a heat conduction effect is further improved, due to the existence of the overflow channel, an infiltration angle exists inside the overflow slot, the bracket has the effect of a QFN / DFN structure, and a space requirement for high-density assembly of a light source is ensured at the same time.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED bracket with an overflow channel and an overflow groove and a manufacturing method thereof. Background technique [0002] At present, cutting-type LED products mostly adopt the form of embedded pads (such as figure 1 shown), but there are the following problems in the way of pad embedding: 1. When soldering, the solder paste is in a molten state, and when placing the LED, it is prone to displacement, and if figure 2 As shown, when the amount of solder paste is different, the height of the device will be different, which will affect the optical effect; 2. The thermal conductivity of the conventional solder paste material is only one tenth of that of copper, which will affect the thermal conductivity of the device. 3. When the solder paste is in a molten state, the cohesive force is large, and it is easy to produce voids when soldering in a reflow furnace, which affe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48
CPCH01L33/48
Inventor 孔一平袁信成周民康
Owner SHANDONG PROSPEROUS STAR OPTOELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com