Circuit board

Abstract

The invention discloses a circuit board comprising a main circuit board body, bonding pads, an insulating layer and transparent conductive adhesive layers. The bonding pads and the insulating layers are arranged on the main circuit board body; windows are formed at the positions, corresponding to the bonding pads, of the insulating layer to expose the bonding pads; and the edges, at the windows, of the insulating layer are close to the outer walls of the bonding pads. And the transparent conductive adhesive layers are arranged at one part of edges or all edges of the bonding pads. Therefore, exposure of wires connected with the bonding pads can be avoided; and the loss of the solder pastes on the bonding pads can be prevented.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board with pads. Background technique [0002] In various electronic products, such as camera modules, mobile phones, electronic watches, etc., circuit boards are usually used to electrically connect various components of the electronic products or form various driving circuits. For example, the surface of the circuit board of the camera module is usually provided with components such as image sensors, capacitors and resistors, wherein the components such as capacitors and resistors are electrically connected to the circuit board through Surface Mounted Technology (SMT). Surface mount technology usually requires a pad on the circuit board. When mounting, first print solder paste on the pad, and then align the corresponding parts of the capacitor, resistor and other components with the pad to The components are accurately installed on the fixed position of the circuit boar...

AI Technical Summary

Problems solved by technology

In the prior art, the edge of the window (that is, the edge of the insulating layer) is outside the pad, that is, the window is larger than the pad, and there is a gap between the edge of the window and the edge of the pad. When the solder paste is coated on the pad or when the solder paste melts, the solder paste easily flows to the gap, resulting in too little tin on the pad, which affects the soldering quality; in the prior art, the size of the pad is often made larger than the actual need Larger size to cover the insulation to the edge of the pad, however, this takes up more routing area and is not suitable for boards with limited area and space

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