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Filler dispersion liquid, ink and application thereof

A technology of dispersion liquid and ink, applied in the field of ink and its application, filler dispersion liquid, can solve the problems of open circuit, black hole, high cost in pattern production, reduce short circuit caused by hidden tin beads, good developability and low resin crack Effect

Active Publication Date: 2022-07-08
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This not only complicates the process and costs a lot, but also the resin plug hole often causes the plug hole to be sunken or black due to air bubbles / impurities in the hole, which in turn leads to an open circuit problem in graphics production.

Method used

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  • Filler dispersion liquid, ink and application thereof
  • Filler dispersion liquid, ink and application thereof
  • Filler dispersion liquid, ink and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0067] This embodiment provides the application of a filler dispersion liquid in the preparation of ink in a plugging process. The filler dispersion liquid is spherical silicon butanone, and the spherical silicon butanone is a dispersion liquid of silicon dioxide. The specific preparation process is as follows: silica (spherical, with an average particle size of 0.5 microns) and methyl ethyl ketone are mixed in a mass ratio of 90:10, and stirred for 10 hours.

[0068] The above-mentioned filler dispersion liquid is mixed with other auxiliary agents, main agents, hardeners and solvents to obtain plugging process ink.

[0069] Among them, the mass ratio of the filler dispersion in the ink is 5%, the mass ratio of the main agent in the ink is 19%, the mass ratio of the hardener in the ink is 31%, and other additives (including photoinitiators) (2,4,6-trimethylbenzoyl-diphenylphosphine oxide) 3.5%, thermal curing agent (triethylamine) 5%, filler 11.5% (TiO 2 and BaSO 4 , the ma...

Embodiment 2

[0075] This embodiment provides the application of a filler dispersion liquid in the preparation of ink for plugging process. The difference from Example 1 is: in the obtained ink, the mass percentages of the main agent and the hardener are 20% and 30% in sequence, and the corresponding mass percentage changes are filled by the solvent.

Embodiment 3

[0077] This embodiment provides the application of a filler dispersion liquid in the preparation of ink for plugging process. The difference from Example 1 is that in the obtained ink, the mass percentages of the main agent and the hardener are 17% and 28% in sequence, and the corresponding mass percentage changes are filled by the solvent.

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Abstract

The invention discloses a filler dispersion liquid, ink and application of the filler dispersion liquid and the ink, the filler dispersion liquid comprises spherical silicon butanone, and the spherical silicon butanone comprises a butanone dispersion liquid of silicon dioxide. Silica and butanone are mixed in advance and then added into ink in the form of dispersion liquid, silica is well dispersed in butanone, and it is avoided that silica is prone to gathering in ink due to separate addition of silica and butanone, consequently, mixing is uneven, reaction is not thorough, and the ink enters a hole during hole plugging is affected; the silicon dioxide has high hardness and good thermal conductivity, has better dispersibility after being prepared into a butanone dispersion liquid, can better reduce the CTE and stress of the ink, fills gaps in a resin molecular chain in the ink, assists in improving the heat resistance of the resin composition, reduces the shrinkage of the ink in a high-temperature environment, and further is not easy to generate cracks or peel in a hole plugging process.

Description

technical field [0001] The invention belongs to the technical field of PCB, and particularly relates to a filler dispersion liquid, ink and application thereof. Background technique [0002] The functional via developable resin plug hole is widely used in the printed circuit board (PCB) manufacturing process, and the quality of the developable resin has an important impact on the client's soldering process. With the rapid development of 5G communication, the integration of PCB design is getting higher and higher, the circuit patterns are more dense, and the spacing of functional vias is getting smaller and smaller. In particular, the problem of cracks is not acceptable. Poor cracks in the developable resin can lead to short circuits caused by tin beads hidden in the welding process, and the risk of open circuit caused by residual liquid in the holes corroding the conductor copper layer. [0003] Developable resin plugging process includes: normal process → graphic productio...

Claims

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Application Information

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IPC IPC(8): C09D11/03C09D11/102H05K3/00
CPCC09D11/03C09D11/102H05K3/0094
Inventor 袁继旺刘天军刘梦茹纪成光杨海云金平
Owner DONGGUAN SHENGYI ELECTRONICS
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