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Mask for packaging four-side pin-free flat semiconductor

A semiconductor, leadless technology, used in semiconductor devices, semiconductor/solid-state device parts, film/sheet adhesives, etc. Sliding improvement effect

Pending Publication Date: 2022-07-01
INNOX ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of a mask sheet utilizing a support film formed with a reinforcing layer, when the mask sheet is wound, the adhesive layer and the reinforcing layer cannot slide against each other due to their adhesive properties, resulting in a gap between the mask sheet and the mask sheet. bubbles or wrinkles

Method used

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  • Mask for packaging four-side pin-free flat semiconductor
  • Mask for packaging four-side pin-free flat semiconductor
  • Mask for packaging four-side pin-free flat semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0079] 1. Manufacture of adhesive layer

[0080] Adhesive layers for mask sheets were fabricated as shown in Table 1 below.

[0081] A varnish was prepared using the polyimide resin of the following molar ratio to prepare a preparation liquid for an adhesive layer.

[0082] Table 1

[0083]

[0084] *TPE-R: 1,3'-bis(4-aminophenoxy)benzene

[0085] *BAPP: 2,2-bis[4-(4-aminophenoxy)phenyl]propane

[0086] *p-PDA: p-phenylenediamine

[0087] *m-Td: 4,4'-diamino-2,2'-dimethylbiphenyl

[0088] *PAM-E: Amino-modified reactive silicone oil (manufactured by Shinetsu silicone)

[0089] *BPDA: 3,3',4,4'-biphenyltetracarboxylic dianhydride

[0090] *PMDA: pyromellitic dianhydride

[0091] *R972: 972 (manufactured by Evonik)

[0092] 2. Manufacture of reinforcement layer

[0093] Reinforcing layers for mask sheets were fabricated as shown in Table 2 below.

[0094] A varnish was prepared using the polyimide resin of the following molar ratio, thereby preparing a preparation...

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PUM

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Abstract

The invention relates to a mask sheet for packaging a QFN (Quad Flat No-lead Flat) semiconductor. The mask sheet for packaging the four-side pin-free flat semiconductor comprises a supporting film, a first electrode and a second electrode, an adhesive layer located on one surface of the support film; and a reinforcing layer which is positioned on the back surface of the surface of the support film on which the adhesive layer is positioned, and in which the sliding friction force of the reinforcing layer with respect to the adhesive layer is 700 gf / 50 mm or less, so that air bubbles or wrinkles are not generated even if the support film is wound and stored for a long period of time.

Description

technical field [0001] The present invention relates to a mask sheet for quad flat non-leaded (QFN, Quad Flat Non-leaded) semiconductor packaging, and to a mask sheet for semiconductor packaging using a quad flat non-leaded (QFN, Quad Flat Non-leaded). lead frames and semiconductor packages. Background technique [0002] So far, with the development trend of personal computers, semiconductor technology has mainly focused on the integration of semiconductor circuits. Recently, based on the trend of thin and light miniaturization of electronic components required for mobile devices (Mobile), current semiconductor technology is becoming more compact and thin. Since the integration of semiconductor packages has been improved by the method of transformation, the manufacturing process of semiconductor devices has also continued to change. [0003] As an example, it is expected that the future market will be dominated by thin, small, and high value-added packaging technologies suc...

Claims

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Application Information

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IPC IPC(8): C09J7/29C09J7/30C09J179/08H01L23/31H01L23/495
CPCC09J7/29C09J7/30C09J179/08H01L23/49586H01L23/3121C09J2301/122C09J2301/16C09J2203/326H01L23/58H01L23/31H01L23/49575H01L23/32H01L23/293H01L24/26H01L24/89H01L23/3737H01L23/562
Inventor 尹勤泳崔裁原赵炯睃赵泳奭金晓临
Owner INNOX ADVANCED MATERIALS CO LTD
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