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Semiconductor circuit board with good heat dissipation and manufacturing method thereof

A technology of semiconductors and circuit boards, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as high cost and complex structure, and achieve simple structure, improved production efficiency, and reduced costs. Effect

Pending Publication Date: 2022-06-24
GUANGDONG HIIC SEMICON LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above defects, an object of the present invention is to propose a semiconductor circuit board with good heat dissipation, which solves the problem that the existing semiconductor circuit board needs to be provided with an additional heat sink for heat dissipation, complex structure and high cost
[0005] In view of the above defects, another object of the present invention is to propose a method for manufacturing a semiconductor circuit board with good heat dissipation, which solves the problem that the existing semiconductor circuit board needs to be provided with an additional heat sink for heat dissipation, complex structure and high cost

Method used

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  • Semiconductor circuit board with good heat dissipation and manufacturing method thereof
  • Semiconductor circuit board with good heat dissipation and manufacturing method thereof
  • Semiconductor circuit board with good heat dissipation and manufacturing method thereof

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Embodiment Construction

[0036] The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.

[0037] In the description of the present invention, it should be understood that the terms "portrait", "horizontal", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than An i...

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Abstract

The invention discloses a semiconductor circuit board with good heat dissipation, which is arranged on the side wall surface of a compressor and comprises a metal substrate, an insulating layer and a chip, the upper surface of the metal substrate is covered with an insulating layer, and the upper surface of the insulating layer is provided with a chip; the lower surface of the metal substrate is of a curved surface structure, the lower surface of the metal substrate is welded to the side wall face of the compressor, and the lower surface of the metal substrate is attached to the side wall face of the compressor. The invention also discloses a manufacturing method of the semiconductor circuit board with good heat dissipation. According to the semiconductor circuit board with good heat dissipation and the manufacturing method thereof, the problems that an existing semiconductor circuit board needs to be provided with an additional heat dissipation device for heat dissipation, the structure is complex, and the cost is high are solved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor circuit board with good heat dissipation and a manufacturing method thereof. Background technique [0002] The modular intelligent power system MIPS (Module Intelligent Power System) not only integrates the power switching device and the drive circuit, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send detection signals to the CPU or DSP for interrupt processing. It is composed of high-speed and low power consumption die, optimized gate-level drive circuit and fast protection circuit. Even in the event of a load accident or improper use, the MIPS itself is not damaged. MIPS generally use IGBTs as power switching elements, and incorporate an integrated structure of current sensors and drive circuits. The existing MIPS modular intelligent power system IC drive control circuit, MIPS sampling amplifi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/498H01L21/48F04C29/00
CPCH01L23/3672H01L23/49811H01L23/49838H01L23/3736H01L21/4846H01L21/4882F04C29/0042H01L2924/181H01L2224/48091H01L2924/00012H01L2924/00014
Inventor 冯宇翔黄浩
Owner GUANGDONG HIIC SEMICON LTD
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