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Die bonding structure and die bonding process

A technology of solid crystal and process, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low reflectivity of ceramic plates and unsatisfactory light brightness, etc., to increase reflectivity, increase heat conduction channels, and improve thermal conductivity Effect

Pending Publication Date: 2022-06-21
深圳市中美欧光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditionally, the LED bracket material of the circuit board is made of ceramic board. The reflectivity of the ceramic board is low, which leads to the unsatisfactory overall light brightness.

Method used

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  • Die bonding structure and die bonding process
  • Die bonding structure and die bonding process
  • Die bonding structure and die bonding process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] refer to figure 1 , the top corner of the substrate 2 is provided with a diagonal groove 23, the function of the diagonal groove 23 is to facilitate the subsequent installation of the LED bracket, and provide a function of positioning the installation direction of the LED bracket, thereby ensuring the accuracy of the installation of the LED bracket.

[0057] refer to figure 1 and figure 2 A sunken groove 21 is provided on the top surface of the substrate 2 away from the base 1. The groove 21 includes a crystal-bonding area for bonding LED chips and a reflection area for increasing the reflection area. The difference between the reflection area and the crystal-bonding area is A first arc-shaped surface 211 is provided at the junction between them. The function of the first arc-shaped surface 211 is to increase the reflective area while enabling a smooth transition of the die-bonding glue between the reflective area and the die-bonding area, reducing the risk of die-bon...

Embodiment 2

Embodiment 3

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PUM

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Abstract

The invention relates to a die bonding structure and a die bonding process, and belongs to the technical field of LED assembly, and the die bonding structure and the die bonding process comprise the following steps: S1, preparing raw materials; s2, checking the LED bracket; s3, checking the LED chip; s4, printing solid crystal glue; s5, carrying out die bonding; s6, die bonding and baking inspection; s7, performing baking; and S8, finished product receiving. Wherein the step S4 of printing the solid crystal glue comprises the following specific steps: S41, preparing the solid crystal glue; s42, an LED support is placed; s43, adjusting the microscope; s44, printing equipment is arranged; s45, printing a solid crystal adhesive; s46, repeated printing is carried out; s47, checking the height of the die bonding glue; s48, checking redundant solid crystal glue; in order to improve the reflectivity of an LED support, the invention provides a die bonding structure and a die bonding process.

Description

technical field [0001] The present application relates to the field of LED assembly, in particular to a crystal bonding structure and a crystal bonding process. Background technique [0002] Solid crystal is also known as Die Bond or chip loading. Die bonding is the process of bonding the chip to the designated area of ​​the bracket through colloid (for LEDs, generally conductive glue or insulating glue) to form a thermal path or an electrical path, which provides conditions for subsequent wiring connections. [0003] The current crystal-bonding method is to carry out crystal-bonding by dispensing: first, use a glue dispenser to drop the crystal-bonding glue on the crystal-bonding area of ​​the LED bracket, and then place the LED chip on the crystal-bonding glue at the glue dispensing place. Finally, place the LED bracket with the LED chip fixed in the heating equipment, and the heating equipment will heat it according to the predetermined temperature curve until the primer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/64H01L33/00
CPCH01L33/005H01L33/60H01L33/48H01L33/486H01L33/642H01L2933/0033
Inventor 王强殷仕乐吕文松
Owner 深圳市中美欧光电科技有限公司
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