Cleaning unit, welding module and welding equipment

Abstract

The invention discloses a cleaning unit, a welding module and welding equipment. According to one embodiment of the present invention, there can be provided a cleaning unit comprising: a gas injection unit that is disposed above an object to be cleaned and that injects gas obliquely toward the object in order to separate contaminants on the object from the object; and a suction unit which is provided on one side of the air blowing unit and includes a suction port for sucking and removing the contaminant separated from the object by the air blowing unit.

Description

technical field [0001] The present invention relates to a cleaning unit for cleaning a substrate or a substrate support member on which a substrate is placed, and a substrate processing apparatus including the same. Background technique [0002] Generally, a semiconductor element can be formed on a silicon wafer serving as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor element is formed can be divided into a plurality of dies by a dicing process, and the singulated die by the dicing process can be welded to a substrate such as a lead frame by a die bonding process. [0003] When the die is soldered to the substrate, if particles adhere to the surface of the substrate, there is a high probability of quality defects such as a drop in adhesion. Therefore, it is very important to remove the particles during the soldering process. Because particles of size 5 to 10 μm can also be the cause of cavities i...

AI Technical Summary

Problems solved by technology

[0005] However, in the conventional blower, since the gas injection port and the suction port are all formed on the surface facing the substrate, the contaminants separated from the substrate or die by the cleaning gas are likely to be unable to be sucked into the suction port and become suspended.

After the cleaning process, the contaminants that could not be sucked into the suction port may be suspended and land again on the parts constituting the substrate or die bonding device, so the cleaning efficiency may decrease

Similarly, if the substrate support member on which the substrate is placed is not carefully managed, the contaminants that once existed in the substrate support member will land on the substrate or the components of the die bonding device, and the cleaning efficiency may decrease.

[0006] In addition, the general air blower is fixedly provided on the upper side of the substrate, so it is not enough to effectively remove the pollutants throughout the entire substrate and prevent the re-attachment of the removed foreign matter

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