Integrated circuit chip flatness detection device and method

Abstract

An integrated circuit chip flatness detection device disclosed by the present invention comprises a machine base, a stand column is welded on the upper surface of the machine base, the stand column is fixedly connected with a fixed block, the side wall of the fixed block is fixedly connected with a plurality of detectors, and the fixed block is rotatably connected with a rotating block through a bearing in a penetrating manner. A detection mechanism for flatness detection is arranged in the rotating block; the detection mechanism comprises a mounting groove formed in the inner side wall of the rotating block, the inner bottom wall of the mounting groove is fixedly connected with an inner gear ring, the inner side wall of the fixed block is fixedly connected with a servo motor through a support, an output shaft of the servo motor is in interference fit with a first gear, and the first gear is meshed with the inner gear ring; the rotating block is provided with eight functional grooves. Compared with the prior art, the chip detection device has the advantages that chips can be continuously and automatically detected, feeding, discharging and classification can be automatically carried out, and therefore the detection efficiency is greatly improved, and meanwhile the equipment cost and the labor cost are reduced.

Description

technical field [0001] The invention relates to the technical field of chip detection, in particular to an integrated circuit chip flatness detection device and method. Background technique [0002] Whether it is an electrical product or other electronic products, the integrated circuit is one of the important internal components. The integrated circuit is a kind of miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , become a microstructure with the required circuit function, and the carrier of the integrated circuit is the chip. After the chip is produced, workers need to test the thickness and pin flatness of the semiconductor chip after production, so as to facilitate the subsequent use of the semiconductor chip. ; ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of low batch detection efficiency in the prior art, and propose a kind of integrated circuit chip flatness detection equipment and method

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