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Prepreg glue flowing control method

A technology of prepreg and control method, applied in multilayer circuit manufacturing, circuit fluid transportation, printed circuit manufacturing and other directions, can solve the problems of rising material, labor and time costs, limiting PCB product stacking design, and high alignment requirements, achieving Improve product reliability, lower production costs, and simplify the alignment process

Pending Publication Date: 2022-05-13
KUSN HULI MICROELECTRONICS
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing technical solutions, methods such as pasting high-temperature tapes and placing gaskets are used to control the glue flow of the prepreg, all of which require cutting out the required size with a knife die, high alignment requirements during the operation process, and the thickness of the high-temperature tape or gasket is extremely large This limits the stack-up design of PCB products; in the scheme of using low-flow glue prepreg or no-flow glue prepreg, in order to protect the copper surface and improve the appearance, Coverlay needs to be pasted, but the process is long, and the cost of materials, manpower and time are all increased

Method used

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0026] The invention provides a method for controlling glue flow of a prepreg, the method comprising:

[0027] Prepare ordinary FR4 prepregs, and use a molding machine to open windows on the prepregs. The size of the windows is 0.05-0.15mm larger than the single side of the cavity or bending groove. like figure 1 shown.

[0028] Spray printing on the window opening of the prepreg, coat or print photothermal curing adhesive with appropriate thickness and width to prevent glue flow, such as figure 2 As shown, the section of the window opening needs to be completely covered.

[0029] Use UV light to irradiate the photothermal curing adhesive to make it initially cured, such as image 3 shown....

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Abstract

The invention discloses a prepreg glue flowing control method, which comprises the following steps of: forming a window on a prepreg, jet printing, coating or printing curing glue at the window of the prepreg, and irradiating the curing glue by light to primarily cure the curing glue; and pressing the primarily cured prepregs through a hot press, and completely curing the primarily cured curing glue under the action of heat of the hot press, so that the curing glue and the laminated plate are combined into a whole. According to the invention, the use of low-flow glue or non-flow glue prepregs can be avoided, and the glue overflow of the prepregs in the pressing process can be effectively controlled, so that the flow glue of the prepregs in the pressing process is prevented from flowing to the cavity or the bending groove; the curing adhesive and the PCB are combined into a whole, other special treatment does not need to be carried out on the curing adhesive in the pressing and follow-up processes, no other waste is generated in the operation process, the national and global waste is reduced in cooperation, and environmental protection is achieved.

Description

technical field [0001] The invention relates to a method for controlling glue flow, in particular to a method for controlling glue flow of a prepreg. Background technique [0002] In the existing technical solutions, methods such as pasting high-temperature tapes and placing gaskets are used to control the glue flow of the prepreg, all of which require cutting out the required size with a knife die, high alignment requirements during the operation process, and the thickness of the high-temperature tape or gasket is extremely large This limits the stack-up design of PCB products; in the scheme of using low-flow glue prepreg or no-flow glue prepreg, in order to protect the copper surface and improve the appearance, Coverlay needs to be pasted, but the process is long, and the cost of materials, manpower and time are all increased. Contents of the invention [0003] The purpose of the present invention is to provide a method for controlling the flow of prepregs, which can avo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4611H05K1/0272H05K2203/06
Inventor 林梦榕胡赵霞肖凯周智洋
Owner KUSN HULI MICROELECTRONICS
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