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Integrated device and manufacturing method of electrostatic chuck

An electrostatic chuck and integrated device technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problem of affecting the temperature uniformity of electrostatic chucks, not mentioning large-area bonding, and inconsistency in edge and internal thermal conductivity and other problems, to achieve the effect of good defect control, high bonding strength and consistent thermal conductivity

Pending Publication Date: 2022-05-13
BEIJING U PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] CN110875230A provides a protective structure, glue filling process and device for the bonding layer of an electrostatic chuck, which can effectively protect the bonding layer, but this document does not mention the defect control of large-area bonding
However, this method is likely to cause inconsistent thermal conductivity between the edge and the interior, which will affect the temperature uniformity of the electrostatic chuck

Method used

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  • Integrated device and manufacturing method of electrostatic chuck
  • Integrated device and manufacturing method of electrostatic chuck
  • Integrated device and manufacturing method of electrostatic chuck

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Such as figure 1 As shown, a normal temperature electrostatic chuck 100 generally does not require a heater and contains an adhesive layer. Wherein, 110 is a ceramic layer, 120 is an adhesive layer, and 130 is a metal base with a cooling function. The adhesive layer 120 is provided with at least one evenly distributed blocks 135 of equal height.

[0056] Such as figure 2 As shown, a variable temperature electrostatic chuck 200, from top to bottom is a ceramic layer 210, a first adhesive layer 220, a heater 230, and a second adhesive layer 240, 250 is a metal base. The first adhesive layer 220 is provided with at least one evenly distributed first equal-height block 235, and the second adhesive layer 240 is provided with at least one evenly distributed second equal-height block 245, such as image 3 shown.

[0057] The adhesives involved in the above electrostatic chucks are elastic adhesives, such as silica gel and silicone rubber, but are not limited to these. The...

Embodiment 2

[0064] Such as Figure 4 As shown, an integrated device 400 of an electrostatic chuck includes a vacuum chamber and a vacuum system, and the vacuum chamber includes an upper chamber 410 and a lower chamber 420 separated by a partition; the vacuum system and The upper chamber 410 and the lower chamber 420 are connected; the upper chamber 410 and the lower chamber 420 are separated by a partition, and the contact positions between the upper and lower chambers and the partition are sealed by a sealing ring 415 .

[0065] The electrostatic chuck 100 or 200 in Embodiment 1 can be positioned in the lower chamber 420 for integration, and the upper chamber 410 is inflated to apply pressure to the electrostatic chuck 100 or 200 through deformation of the partition.

[0066] The upper chamber 410 and the lower chamber 420 may optionally be evacuated or at atmospheric pressure.

[0067] The vacuum pumping system includes a first vacuum pump pipeline 434, a second vacuum pump pipeline 43...

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Abstract

The invention relates to the technical field of electrostatic chucks, in particular to an electrostatic chuck integration device and a manufacturing method. The electrostatic chuck integration device comprises a vacuum cavity and a vacuumizing system, and the vacuum cavity comprises an upper cavity and a lower cavity which are separated by a partition plate; the vacuumizing system is connected with the upper chamber and the lower chamber; the vacuumizing system comprises a first vacuum pump pipeline, a second vacuum pump pipeline, an inflation pipeline, an exhaust pipeline and a vacuum pipeline. The electrostatic chuck integrally manufactured by adopting the device and the method has the characteristics of high bonding strength, no bubble and the like, and each bonding layer is uniform; the heat conductivity coefficients of the edge and the interior are consistent, the temperature uniformity of the electrostatic chuck is not affected, and the defect of large-area bonding is well controlled.

Description

technical field [0001] The invention relates to the technical field of electrostatic chucks, in particular to an integrated device and a manufacturing method of an electrostatic chuck. Background technique [0002] Electrostatic chuck is the stage of wafer precision processing equipment, often installed in PVD coating equipment, etching equipment, ion implantation equipment, EUV lithography machine and other equipment, as one of the core components of the above equipment. [0003] As the CD value continues to shrink, the integration of devices on the wafer surface increases, and the size of the devices is small and precise. At the same time, the electrostatic chuck supporting the wafer is required to have high processing accuracy and excellent uniformity. [0004] The basic composition of etching type and ion implantation type normal temperature electrostatic chuck is metal base with cooling function, adhesive layer, and ceramic parts with adsorption function from bottom to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/6831H01L21/6833H01L21/67017
Inventor 张玉利杨鹏远王建冲王超星
Owner BEIJING U PRECISION TECH
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