Dewelding device, system and method

Abstract

The invention discloses a desoldering device, equipment and method, the desoldering device comprises a microwave heater, the microwave heater is used for heating welding spot welding flux with the surface coated with scaling powder until the welding spot welding flux is molten, the scaling powder can be heated by the microwave heater, and the boiling point of the scaling powder is higher than the melting point of the welding spot welding flux. Due to the fact that the scaling powder contains water molecules or hydrogen and oxygen atoms, when the scaling powder is placed in the microwave heater with the specific wavelength, when the scaling powder on the surface of the welding flux is heated, the temperature of the scaling powder is increased, and heat is conducted to the welding flux. The boiling point of the selected soldering flux is higher than the melting point of the soldering flux, and the soldering flux can be melted before the soldering flux reaches the boiling point by means of the heat conduction effect. And desoldering of the device is realized. In other words, the soldering flux is indirectly heated, and then heat is conducted to the welding flux to melt the welding flux. Meanwhile, due to the characteristics of microwaves, different welding spot solders with scaling powder in a large planar area can be synchronously heated, so that the desoldering efficiency is improved, and the desoldering cost is reduced.

Description

technical field [0001] The invention relates to the technical field of electric appliance welding, in particular to a desoldering device, system and method. Background technique [0002] In the production process of electronic products, in order to reduce the cost, the usable components on the scrapped products are recycled and reused by desoldering, or more solder joint components such as ICs need to be replaced and repaired in the products. [0003] Traditional desoldering methods include galvanometer scanning and other methods. The PIN pin of the device (also called solder joint solder) is heated to melt the solder on the PIN pin into a liquid state, and then the device is separated from the substrate. When using a heat gun to heat the solder joint, the direction of the hot air and the size of the heating point cannot be accurately and effectively controlled, and the heat is likely to affect the surrounding devices during the heating process. When using the galvanometer ...

AI Technical Summary

Problems solved by technology

When using a hot air gun to heat the solder joint, the direction of the hot air and the size of the heating spot cannot be accurately and effectively controlled, and the heat is likely to affect the surrounding devices during the heating process.

When using the galvanometer to scan, due to the multiple metal materials on the surface of the component, the laser has a reflection or diffuse reflection effect, which is likely to cause burns to the surrounding components; at the same time, when the laser is used for desoldering, it can only be soldered to the point, and the desoldering efficiency is low.

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