Manufacturing method of embedded magnetic circuit board and electronic component

Abstract

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a manufacturing method of a magnetic-buried circuit board and an electronic component. The manufacturing method of the embedded magnetic circuit board comprises the following steps of: preparing two substrates, and oppositely arranging the two substrates; burying magnets, arranging a bearing plate with preset strength between the two substrates, forming an accommodating through groove in the bearing plate, arranging bonding layers on two side plate surfaces of the bearing plate, accommodating the first magnet in the accommodating through groove, and respectively pressing and bonding the two substrate surfaces on the two side plate surfaces of the bearing plate at preset temperature and preset pressure; filling, namely forming an accommodating hole in one of the substrates, enabling the accommodating hole to penetrate through the first magnet, enabling the area of the cross section of the first magnet parallel to the bearing plate to be larger than that of the cross section of the accommodating hole parallel to the bearing plate, and filling the accommodating hole with the magnetic conductive adhesive; and curing: curing the magnetic conductive adhesive. The total inductance value of the circuit board is improved, the size of the circuit board does not need to be enlarged, and miniaturization of the circuit board is facilitated.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a method for manufacturing a buried magnetic circuit board and electronic components. Background technique [0002] At present, with the development of power module PCB, the solution of using buried magnetic technology to replace traditional mounted inductive components has emerged. It has the advantages of small size and light weight. Because buried magnetic does not require soldering points, the reliability performance will be better. . However, most of the industry currently embeds a single magnetic core (sheet or column), so that the mutual inductance between the coil and the magnetic core is limited to a single direction. Therefore, the inductance of the circuit board is small and cannot meet the specific requirements. [0003] The traditional way to increase the inductance is to increase the number of conductive coils, but the increase in th...

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Problems solved by technology

However, most of the current industry is to embed a single magnetic core (sheet or column), so that the mutual inductance between the coil and the magnetic core is limited to a single direction. Therefore, the inductance of the circuit board is small and cannot meet the specific requirements.

[0003] The traditional way to increase the inductance value is to increase the number of conductive coils, but the increase in the number of coils makes the board area occupied by the inductance element larger, which is not conducive to the miniaturization of the printed circuit board size.

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