LED device

Abstract

The embodiment of the invention discloses an LED device. The LED device comprises a support and an LED chip. The bracket comprises an insulating substrate, and a first electrode and a second electrode which are arranged on the insulating substrate and insulated from each other; the first electrode comprises a first connecting part, a first welding part and a functional part, the root part of the first welding part is connected with the first connecting part, the middle part of the first welding part extends towards the second electrode to form the functional part, the first welding part comprises at least one end part, and the end part of the first welding part is connected with the functional part; the second electrode comprises a second connecting part and a second welding part, and the root of the second welding part is connected with the second connecting part. According to the technical scheme provided by the embodiment of the invention, the proper end part can be selected for wire welding according to the position of the electrode on the LED chip, the extension path of the welding part is designed, and the path of water vapor permeating into the LED device can be prolonged, so that the hydrolysis resistance of the LED device is improved, and the service life of the LED device is prolonged.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductors, and in particular to an LED device. Background technique [0002] Conventional chip LED devices include brackets, LED chips, bonding wires and encapsulation glue. In the LED device processing process, the LED chip is first fixed on the bracket, and then the two ends of the bonding wire are respectively bonded to the bracket electrode and the LED chip electrode, and finally the LED chip and the bonding wire are covered with encapsulation glue. During the bonding process of the bonding wire, when the distance between the electrode of the LED chip and the edge of the LED chip is relatively long, the bonding wire is likely to touch the edge of the LED chip, resulting in leakage of electricity from the LED device and reducing the reliability of the LED device. During the encapsulation adhesive covering process, due to the difference in material properties between the ...

AI Technical Summary

Problems solved by technology

During the bonding process of the bonding wire, when the distance between the electrode of the LED chip and the edge of the LED chip is far away, the bonding wire is easy to touch the edge of the LED chip, causing leakage of the LED device and reducing the reliability of the LED device

During the encapsulation adhesive covering process, due to the difference in material properties between the encapsulation adhesive and the stent electrodes, gaps are likely to be formed when the encapsulation adhesive and the stent electrodes are combined. The gap between the packaging glue and the bracket electrode invades into the interior of the LED device, which accelerates the migration of metal ions on the surface of the bracket electrode, causing the LED chip electrode to fall off and disconnect, resulting in LED device failure and reduced reliability of the LED device.

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