Pre-pressing device based on chip packaging

Abstract

The invention discloses a pre-pressing device for chip packaging, and relates to the technical field of chip packaging, and the pre-pressing device comprises a base and a carrier assembly. Frame plates are symmetrically arranged on the two sides of the surface of the base, a sliding assembly is arranged at the top ends of the frame plates, a rolling assembly and a lifting assembly are arranged on the sliding assembly, and a moving assembly is arranged on the sliding assembly. The carrier assembly comprises guide rods, side seats, a carrying seat, limiting grooves and springs, the guide rods are evenly arranged on the two sides of the surface of the bottom plate, the side seats movably sleeve the guide rods through sleeve holes in the middles, the two sides of the carrying seat are fixedly connected with the ends of the side seats on the two sides respectively, the limiting grooves are evenly formed in the surface of the carrying seat, and the two ends of each limiting groove are through; according to the pre-pressing device for chip packaging, pre-pressing is more comprehensive and uniform, the pre-pressing pressure can be conveniently adjusted according to needs, and the practicability is high.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a pre-pressing device based on chip packaging. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge to communicate the internal world of the chip and the external circuit. The contacts on the chip are connected to the leads of the package shell by wires. On the pins, these pins are connected to other devices through the wires on the printed board, so the package plays an important role for the CPU and other LSI integrated circuits. After the chip is packaged, the packaged chip needs to be pre-pressed. To make the chip package flat, the preload of the existing part of the preloading device is not uniform and comprehensive, resulting in that some packaged chips cannot be fully preloaded; and the pressur...

AI Technical Summary

Problems solved by technology

[0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge to communicate the internal world of the chip and the external circuit. The contacts on the chip are connected to the leads of the package shell by wires. On the pins, these pins are connected to other devices through the wires on the printed board, so the package plays an important role for the CPU and other LSI integrated circuits. After the chip is packaged, the packaged chip needs to be pre-pressed. To make the chip package flat, the preload of the existing part of the preloading device is not uniform and comprehensive, resulting in that some packaged chips cannot be fully preloaded; and the pressure of the preload is inconvenient to adjust. Therefore, we propose a method based on chip packaging. Preloading device

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