Overflow blocking type silk screen and PI film laminating device and laminating method thereof

Abstract

The invention discloses an overflow blocking type silk screen and PI film laminating device and a laminating method thereof. The overflow blocking type silk screen and PI film laminating device comprises an upper flow blocking mechanism and a lower flow blocking mechanism, according to the device, glue overflowing through extrusion can be stably bonded without being wasted, when a PI film is extruded by the upper hot pressing plate, the glue overflowing from the periphery is blocked by the periphery of the upper flow blocking ring body, so that the overflowing glue cannot overflow towards the periphery and enter the upper overflowing ring groove, then the overflowing glue slowly flows downwards from the upper overflowing ring groove, and the glue overflowing from the periphery of the PI film is blocked by the periphery of the upper flow blocking ring body. The overflowing glue downwards passes through the silk screen and then reaches the lower overflowing ring groove, due to the fact that the periphery of the lower flow blocking ring body is blocked, the overflowing glue can flow towards the penetrating and connecting film strips on the inner side, finally the overflowing glue is solidified and connected between the penetrating and connecting film strips and the silk screen, tight fixed connection is achieved, and the connectivity of the PI film and the silk screen is improved.

Description

technical field [0001] The invention relates to a laminating device and laminating method of an overflow barrier type silk screen and a PI film. Background technique [0002] Screen printing technology is an ancient civilization and a long-lasting industry, which is widely used in people's production and life. Especially in recent years, with the high development of the electronics industry, the screen printing process has been well applied, and a vibrant scene has emerged. The development of the existing printing screen is constantly improving, and the structure and technology are also constantly upgraded. The existing printing screen uses PI film instead of traditional photosensitive glue, and the PI film is coated with glue and directly covered by hot pressing. On the screen, the printing pattern is formed by directly engraving the PI film, but when the hot platen presses the PI film downward, it will often cause the PI film to move and wrinkle, which makes the hot press...

AI Technical Summary

Problems solved by technology

Especially in recent years, with the high development of the electronics industry, the screen printing process has been well applied, and a vibrant scene has emerged. The development of the existing printing screen is constantly improving, and the structure and technology are also constantly upgraded. The existing printing screen uses PI film instead of traditional photosensitive glue, and the PI film is coated with glue and directly covered by hot pressing. On the screen, the printing pattern is formed by directly engraving the PI film, but when the hot platen presses the PI film downward, it will often cause the PI film to move and wrinkle, which makes the hot pressing success rate low. When the screen is hot-pressed and bonded, the glue on the PI film will overflow from the outside of the PI film due to pressure, making the PI film and the screen bonded weakly, which makes the reliability of the structure poor

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